AD9245BCP-65EBZ Analog Devices Inc, AD9245BCP-65EBZ Datasheet - Page 9

• Manufacturer Part Number: AD9245BCP-65EBZ
• Description: BOARD EVAL FOR AD9245BCP-65
• Manufacturer: Analog Devices Inc

Specifications of AD9245BCP-65EBZ

• Number Of Adc's: 1
• Number Of Bits: 14
• Sampling Rate (per Second): 65M
• Data Interface: Parallel
• Inputs Per Adc: 1 Differential
• Input Range: 2 Vpp
• Power (typ) @ Conditions: 320mW @ 65MSPS
• Voltage Supply Source: Single
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9245BCP-65
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
ELECTRICAL
ENVIRONMENTAL
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
AVDD
DRVDD
AGND
AVDD
D0 to D13
CLK, MODE
VIN+, VIN–
VREF
SENSE
REFT, REFB
PDWN
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering 10 sec)
Junction Temperature
With Respect to
AGND
DGND
DGND
DRVDD
DGND
AGND
AGND
AGND
AGND
AGND
AGND
Min
–0.3
–0.3
–0.3
–3.9
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–65
–40
Max
+3.9
+3.9
+0.3
+3.9
DRVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
+125
+85
300
150
Unit
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
°C
Rev. D | Page 9 of 32
THERMAL RESISTANCE
θ
in still air, in accordance with EIA/JESD51-1.
Table 8. Thermal Resistance
Package Type
32-Lead LFCSP
Airflow increases heat dissipation, effectively reducing θ
In addition, more metal directly in contact with the package
leads from metal traces, through holes, ground, and power
planes reduces the θ
paddle be soldered to the ground plane for the LFCSP package.
There is an increased reliability of the solder joints, and
maximum thermal capability of the package is achieved with
the exposed paddle soldered to the customer board.
JA
is specified for the worst-case conditions on a 4-layer board
JA
. It is recommended that the exposed
θ
32.5
JA
θ
32.71
JC
AD9245
Unit
°C/W
JA
.