w25p16 Winbond Electronics Corp America, w25p16 Datasheet
w25p16
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w25p16 Summary of contents
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... AND 16M-BIT SERIAL FLASH MEMORY Formally NexFlash NX25P80 and NX25P16 The Winbond W25P80/16 are fully compatible with the previous NexFlash NX25P80/16 Serial Flash memories. W25P80 AND W25P16 Publication Release Date: September 22, 2006 - 1 - Revision L ...
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... Block Protect Bits (BP2, BP1, BP0)................................................................................11 9.1.4 Reserved Bits .................................................................................................................11 9.1.5 Status Register Protect (SRP)........................................................................................11 9.1.6 Status Register Memory Protection ................................................................................12 9.2 INSTRUCTIONS........................................................................................................... 13 9.2.1 Manufacturer and Device Identification ..........................................................................13 9.2.2 Instruction Set 9.2.3 Write Enable (06h)..........................................................................................................15 9.2.4 Read Status Register (05h) ............................................................................................16 9.2.5 Write Status Register (01h) ............................................................................................17 9.2.6 Read Data (03h) .............................................................................................................18 9.2.7 Fast Read (0Bh) .............................................................................................................19 W25P80 AND W25P16 (1) ............................................................................................................. ...
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... AC Measurement Conditions........................................................................................ 35 10.6 AC Electrical Characteristics ........................................................................................ 36 10.7 Serial Output Timing ..................................................................................................... 38 10.8 Input Timing .................................................................................................................. 38 10.9 Hold Timing................................................................................................................... 38 11. PACKAGE SPECIFICATION .................................................................................................... 39 11.1 8-Pin SOIC 208-mil (Winbond Package Code SS)....................................................... 39 11.2 16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 40 12. ORDERING INFORMATION .................................................................................................... 41 13. REVISION HISTORY ................................................................................................................ 42 W25P80 AND W25P16 Publication Release Date: September 22, 2006 - 3 - Revision L ...
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... GENERAL DESCRIPTION The W25P80 (8M-bit) and W25P16 (16M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µ ...
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... PIN DESCRIPTION 208-MIL PIN NO. PIN NAME 1 / /WP 4 GND CLK 7 /HOLD 8 VCC W25P80 AND W25P16 I/O FUNCTION I Chip Select Input O Data Output I Write Protect Input Ground I Data Input I Serial Clock Input I Hold Input Power Supply Publication Release Date: September 22, 2006 - 5 - ...
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... PIN CONFIGURATION 300-MIL Figure 1b. W25P16 Pin Assignments, 16-pin SOIC 300-mil 6. PIN DESCRIPTION 300-MIL PAD NO. PAD NAME 1 /HOLD 2 VCC 3 N/C 4 N/C 5 N/C 6 N /WP 10 GND 11 N/C 12 N/C 13 N CLK W25P80 AND W25P16 I/O FUNCTION I Hold Input Power Supply No Connect No Connect No Connect No Connect I Chip Select Input ...
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... Package Types The W25P80/16 are primarily offered in SOIC packages. The W25P80 and W25P16 use an 8-pin plastic 208-mil width SOIC (Winbond package code SS) (NexFlash package code S) and the W25P16 also uses a 16-pin plastic 300-mil width SOIC (Winbond package code SF) (NexFlash package code F) as shown in figures 1A and 1B respectively ...
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... BLOCK DIAGRAM W25P80 AND W25P16 Figure 2. W25P80 and W25P16 Block Diagram - 8 - ...
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... N Time delay write disable after Power-up. N Write enable/disable instructions. N Automatic write disable after program and erase. N Software write protection using Status Register. N Hardware write protection using Status Register and /WP pin. N Write Protection using Power-down instruction. W25P80 AND W25P16 Publication Release Date: September 22, 2006 - 9 - Revision L ...
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... Write Enable Instruction. The WEL status bit is cleared when the device is write disabled. A write disable state occurs upon power-up or after any of the following instructions: Write Disable, Page Program, Sector Erase, Chip Erase and Write Status Register. W25P80 AND W25P16 time delay is reached. If needed a pull-up resister on /CS can ...
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... When the SRP pin is set the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is high the Write Status Register instruction is allowed. W25P80 AND W25P16 in AC characteristics). All, none or a portion of the memory array W Figure 3 ...
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... Note don’t care W25P80 AND W25P16 W25P16 (16M-BIT) MEMORY PROTECTION ADDRESSES NONE 31 1F0000h - 1FFFFFh 1E0000h - 1FFFFFh 1C0000h - 1FFFFFh 180000h - 1FFFFFh 100000h - 1FFFFFh ALL 000000h - 1FFFFFh W25P80 (8M-BIT) MEMORY PROTECTION ADDRESSES NONE 15 ...
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... Status Register is being written, all instructions except for Read Status Register will be ignored until the program or erase cycle has completed. 9.2.1 Manufacturer and Device Identification MANUFACTURER ID Winbond Serial Flash Device ID Instruction W25P80 W25P16 W25P80 AND W25P16 (M7-M0) EFh (ID7-ID0) (ID15-ID0) ABH, 90h 9Fh 13h 2014h 14h ...
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... The Page Program instruction programs in increments of one word (two bytes time. The Program address A23-A16 must be an “Even” Address (A0 must equal 0). 4. See Manufacturer and Device Identification table for Device ID information 5. The Device ID will repeat continuously until //CS terminates the instruction. W25P80 AND W25P16 BYTE 2 (5) BYTE 3 BYTE 4 (1) (S7– ...
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... DI pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon completion of the Write Status Register, Page Program, Sector Erase, and Chip Erase instructions. Figure 5. Write Disable Instruction Sequence Diagram W25P80 AND W25P16 Publication Release Date: September 22, 2006 - 15 - Revision L ...
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... Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the cycle is complete and if the device can accept another instruction. The Status Register can be read continuously, as shown in figure 6. The instruction is completed by driving /CS high. Figure 6. Read Status Register Instruction Sequence Diagram W25P80 AND W25P16 - 16 - ...
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... When the SRP pin is set the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is high the Write Status Register instruction is allowed. Figure 7. Write Status Register Instruction Sequence Diagram W25P80 AND W25P16 (See AC Characteristics). While W Publication Release Date: September 22, 2006 ...
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... Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on the current cycle. The Read Data instruction allows clock rates from D. maximum Electrical Characteristics). W25P80 AND W25P16 Figure 8. Read Data Instruction Sequence Diagram - see ...
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... The dummy byte data value on the DI pin is a “don’t care”. Figure 9. Fast Read Instruction Sequence Diagram W25P80 AND W25P16 (see AC Electrical Characteristics). This is accomplished by adding a R Publication Release Date: September 22, 2006 ...
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... After the Page Program cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Page Program instruction will not be executed if the addressed page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory Protection table). Figure 10. Page Program Instruction Sequence Diagram W25P80 AND W25P16 - 20 - ...
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... Erase instruction will not be executed if the addressed page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory Protection table). Figure 11. Sector Erase Instruction Sequence Diagram W25P80 AND W25P16 (See AC Characteristics). While the Sector SE Publication Release Date: September 22, 2006 ...
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... Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed if any page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory Protection table). Figure 12. Chip Erase Instruction Sequence Diagram W25P80 AND W25P16 (See AC Characteristics). While the Chip Erase cycle ...
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... Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 15. The Device ID values for the W25P80 and W25P16 are listed in Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction is completed by driving /CS high ...
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... BUSY equals 1) the instruction is ignored and will not have any effects on the current cycle. Figure 14. Release Power-down Instruction Sequence Figure 15. Release Power-down / Device ID Instruction Sequence Diagram W25P80 AND W25P16 (See AC Characteristics). After this time duration the RES2 - 24 - ...
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... Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 16. The Device ID values for the W25P80 and W25P16 are listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID ...
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... Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 17. For the W25P80, the Memory Type is 20h and the Capacity is 14h. For the W25P16, the Memory type is also 20h and the Capacity is 15h. W25P80 AND W25P16 Figure 17 ...
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... Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on the current cycle. The Read Parameter Page instruction allows clock rates from D. maximum of f (see AC Electrical Characteristics). R Figure 18. Read Parameter Page Instruction Sequence Diagram W25P80 AND W25P16 in AC Electrical Characteristics). PE Publication Release Date: September 22, 2006 - 27 - Revision L ...
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... The dummy byte allows the devices internal circuits additional time for setting up the initial address. The dummy byte data value on the DI pin is a “don’t care”. Figure 19. Fast Read Parameter Page Instruction Sequence Diagram W25P80 AND W25P16 - 28 - (see AC Electrical ...
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... After the program cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Program Parameter Page instruction will not be executed if the addressed page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory Protection table). W25P80 AND W25P16 Publication Release Date: September 22, 2006 - 29 - Revision L ...
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... Figure 20. Parameter Page Program Instruction Sequence Diagram - 30 - W25P80 AND W25P16 ...
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... The Erase Parameter Page instruction will not be executed if any page is protected by the Block Protect (BP2, BP1, BP0) bits (see Status Register Memory Protection table). Figure 21. Parameter Page Erase Instruction Sequence Diagram W25P80 AND W25P16 (See AC Characteristics). While PE Publication Release Date: September 22, 2006 ...
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... Operating Ranges PARAMETER SYMBOL (1) Supply Voltage VCC Ambient Temperature, Operating Note: 1. VCC voltage during Read can operate across the min and max range but should not exceed ±10% of the programming (erase/write) voltage. W25P80 AND W25P16 (1) SYMBOL CONDITIONS VCC V Relative to Ground IO T STG T ...
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... Power-up Timing and Write Inhibit Threshold PARAMETER VCC (min) to /CS Low Time Delay Before Write Instruction Write Inhibit Threshold Voltage Note: 1. These parameters are characterized only. W25P80 AND W25P16 SYMBOL MIN t (1) VSL t (1) PUW V (1) WI Figure 22. Power-up Timing and Voltage Levels ...
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... Input High Voltage V IH Output Low Voltage V OL Output High Voltage V OH Notes: 1 .See Preliminary Designation. 2. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V 3. Checker Board Pattern. W25P80 AND W25P16 (1) CONDITIONS MIN ( (2) OUT /CS = VCC, ...
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... AC Measurement Conditions PARAMETER Load Capacitance Input Rise and Fall Times Input Pulse Voltages Output Timing Reference Voltages Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. W25P80 AND W25P16 SYMBOL 0.2 VCC 0.3 VCC to UT Figure 23. AC Measurement I/O Waveform ...
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... Active Hold Time relative to CLK (2.7V-3.6V / 3.0V-3.6V) /CS Not Active Setup Time relative to CLK /CS Deselect Time Output Disable Time (2.7V-3.6V / 3.0V-3.6V) Clock Low to Output Valid (2.7V-3.6V / 3.0V-3.6V) Output Hold Time /HOLD Active Setup Time relative to CLK (2.7V-3.6V / 3.0V-3.6V) /HOLD Active Hold Time relative to CLK W25P80 AND W25P16 SYMBOL ALT MIN D.C. D.C. f D.C. ...
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... Page Program Cycle Time 3.0V-3.6V VCC 2.7V-3.6V VCC Sector Erase Cycle Time Chip Erase Cycle Time W25P80 Chip Erase Cycle Time W25P16 Parameter Page Erase Cycle Time Notes: 1. Clock high + Clock low must be less than or equal to 1/f 2. Value guaranteed by design and/or characterization, not 100% tested in production. ...
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... Serial Output Timing 10.8 Input Timing 10.9 Hold Timing W25P80 AND W25P16 - 38 - ...
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... Notes: 1. Controlling dimensions: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. W25P80 AND W25P16 MILLIMETERS INCHES MIN MAX MIN 1.75 2.16 0.069 0.05 ...
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... E1 ( Notes: 1. Controlling dimensions: inches, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. W25P80 AND W25P16 MILLIMETERS INCHES MIN MAX MIN 2.36 2.64 0.093 0.10 ...
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... Only the second letter is used for part marking. 3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T), when placing orders W25P80 AND W25P16 (3) Publication Release Date: September 22, 2006 - 41 - Revision L ...
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... MLP. Changed 200-mil SOIC reference to 208-mil SOIC. Updated dimensional table for the 208milSOIC in the packaging information. Added 208milSOIC and removed 5x6mm MLP for W25P16. Added Parameter Page data to Features, Block Diagram (Figure 2), Status Register Memory Protection, Instruction Set and Manufacturer and Device Identification ...
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... Winbond for any damages resulting from such improper use or sales. The Winbond W25P80/16 are fully compatible with the previous NexFlash NX25P80/16 Serial Flash memories. W25P80 AND W25P16 Important Notice Publication Release Date: September 22, 2006 - 43 - ranteed. Winbond or an ...