PESD3V3U1UB,115 NXP Semiconductors, PESD3V3U1UB,115 Datasheet
PESD3V3U1UB,115
Specifications of PESD3V3U1UB,115
934062952115
PESD3V3U1UB T/R
Related parts for PESD3V3U1UB,115
PESD3V3U1UB,115 Summary of contents
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PESD3V3U1UA; PESD3V3U1UB; PESD3V3U1UL Ultra low capacitance unidirectional ESD protection diodes Rev. 01 — 30 October 2008 1. Product profile 1.1 General description Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin PESD3V3U1UA; PESD3V3U1UB 1 2 PESD3V3U1UL 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PESD3V3U1UA PESD3V3U1UB PESD3V3U1UL 4. Marking Table 5. Type number PESD3V3U1UA PESD3V3U1UB PESD3V3U1UL PESD3V3U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg Table unless otherwise specified. amb Symbol V ESD [1] Device stressed with ten non-repetitive ESD pulses. Table 8. Standard IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model) Fig 1 ...
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... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol V RWM dif 2 (pF) 2.5 2.4 2.3 2 MHz amb Fig 2. Diode capacitance as a function of reverse voltage; typical values PESD3V3U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes Characteristics Parameter Conditions ...
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... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) GND unclamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 4. ESD clamping test setup and waveforms PESD3V3U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes ...
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... NXP Semiconductors 7. Application information The PESD3V3U1Ux series is designed for the protection of one unidirectional data or signal line from the damage caused by ESD. The devices may be used on lines where the signal polarities are either positive or negative with respect to ground. Fig 5. Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD and Electrical Fast Transient (EFT) ...
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... NXP Semiconductors 9. Package outline 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 6. Package outline PESD3V3U1UA (SOD323/SC-76) Fig 8. Package outline PESD3V3U1UL (SOD882) 10. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number ...
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... NXP Semiconductors 11. Soldering 1.65 Fig 9. 2.75 Fig 10. Wave soldering footprint PESD3V3U1UA (SOD323/SC-76) PESD3V3U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes 3.05 2.1 0.95 2 Reflow soldering footprint PESD3V3U1UA (SOD323/SC-76) 5 2 Rev. 01 — 30 October 2008 PESD3V3U1UA/UB/ Dimensions in mm ...
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... NXP Semiconductors Fig 11. Reflow soldering footprint PESD3V3U1UB (SOD523/SC-79) 0.9 Fig 12. Reflow soldering footprint PESD3V3U1UL (SOD882) PESD3V3U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes 2.15 1.1 1 Reflow soldering is the only recommended soldering method. 1.3 0.7 ...
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... NXP Semiconductors 12. Revision history Table 11. Revision history Document ID Release date PESD3V3U1UA_UB_UL_1 20081030 PESD3V3U1UA_UB_UL_1 Product data sheet PESD3V3U1UA/UB/UL Ultra low capacitance unidirectional ESD protection diodes Data sheet status Change notice Product data sheet - Rev. 01 — 30 October 2008 Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information Soldering ...