PESD5V0X1BL,315 NXP Semiconductors, PESD5V0X1BL,315 Datasheet
PESD5V0X1BL,315
Specifications of PESD5V0X1BL,315
934061649315
PESD5V0X1BL T/R
Related parts for PESD5V0X1BL,315
PESD5V0X1BL,315 Summary of contents
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PESD5V0X1BL Ultra low capacitance bidirectional ESD protection diode Rev. 02 — 16 July 2009 1. Product profile 1.1 General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates pin 1. 3. Ordering information Table 3. Type number PESD5V0X1BL 4. Marking Table 4. Type number PESD5V0X1BL 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device amb ...
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... NXP Semiconductors Table 7. Standard Per diode IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model) Fig 1. PESD5V0X1BL_2 Product data sheet Ultra low capacitance bidirectional ESD protection diode ESD standards compliance I PP 100 % 0 ESD pulse waveform according to IEC 61000-4-2 Rev. 02 — 16 July 2009 ...
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... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol Per diode V RWM dif 1 (pF) 0.96 0.92 0.88 0.84 0. MHz amb Fig 2. Diode capacitance as a function of reverse voltage; typical values PESD5V0X1BL_2 Product data sheet Ultra low capacitance bidirectional ESD protection diode ...
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... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) GND unclamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 4. ESD clamping test setup and waveforms PESD5V0X1BL_2 Product data sheet Ultra low capacitance bidirectional ESD protection diode ...
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... NXP Semiconductors 7. Application information PESD5V0X1BL is designed for the protection of one bidirectional data or signal line from the damage caused by ESD. The device may be used on lines where the signal polarities are both, positive and negative with respect to ground. Fig 5. Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD and Electrical Fast Transient (EFT) ...
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... NXP Semiconductors 9. Package outline Fig 6. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PESD5V0X1BL [1] For further information and the availability of packing methods, see PESD5V0X1BL_2 Product data sheet Ultra low capacitance bidirectional ESD protection diode ...
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... NXP Semiconductors 11. Soldering 0.9 Fig 7. PESD5V0X1BL_2 Product data sheet Ultra low capacitance bidirectional ESD protection diode 1.3 0 Reflow soldering is the only recommended soldering method. Reflow soldering footprint PESD5V0X1BL (SOD882) Rev. 02 — 16 July 2009 PESD5V0X1BL R0. 0.6 0 Dimensions in mm © NXP B.V. 2009. All rights reserved. ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date PESD5V0X1BL_2 20090716 • Modifications: Type number PESD5V0X1BA removed • Figure • Section 13 “Legal PESD5V0X1BA_ 20081104 PESD5V0X1BL_1 PESD5V0X1BL_2 Product data sheet Ultra low capacitance bidirectional ESD protection diode Data sheet status ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information Soldering ...