PESD5V0L5UY,115 NXP Semiconductors, PESD5V0L5UY,115 Datasheet - Page 13

DIODE 5FOLD ESD PROTECT SOT363

PESD5V0L5UY,115

Manufacturer Part Number
PESD5V0L5UY,115
Description
DIODE 5FOLD ESD PROTECT SOT363
Manufacturer
NXP Semiconductors
Type
TVSr
Datasheet

Specifications of PESD5V0L5UY,115

Package / Case
SC-70-6, SC-88, SOT-363
Voltage - Reverse Standoff (typ)
5V
Voltage - Breakdown
6.4V
Power (watts)
25W
Polarization
5 Channel Array - Unidirectional
Mounting Type
Surface Mount
Polarity
Unidirectional
Clamping Voltage
10 V
Operating Voltage
5 V
Breakdown Voltage
6.8 V
Termination Style
SMD/SMT
Peak Surge Current
2.5 A
Peak Pulse Power Dissipation
25 W
Capacitance
16 pF
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 65 C
Dimensions
1.35 mm W x 2.2 mm L x 1.1 mm H
Capacitance Value
19 pF
Maximum Clamping Voltage
12 V
Direction Type
Uni-Directional
Number Of Elements Per Chip
5
Esd Protection Voltage
10@HBM|20@Contact Disc KV
Maximum Leakage Current
0.025 uA
Maximum Working Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4052-2
934057803115
PESD5V0L5UY T/R
PESD5V0L5UY T/R
NXP Semiconductors
PESDXL5UF_V_Y_2
Product data sheet
Fig 15. Reflow soldering footprint PESDxL5UV (SOT666)
Fig 16. Reflow soldering footprint PESDxL5UY (SOT363/SC-88)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
2.00 1.70 1.00
Low capacitance unidirectional fivefold ESD protection diode arrays
0.075
solder lands
solder resist
occupied area
solder paste
Rev. 02 — 8 January 2008
0.55
(2 )
solder lands
solder resist
2.35
0.50
(4 )
0.50
(4 )
2.75
2.45
2.10
1.20
2.20
2.50
1.60
placement area
occupied area
2.65
1.20
2.40
PESDxL5UF/V/Y
0.60
(2 )
Dimensions in mm
0.30 (2 )
0.40
(2 )
0.375
0.15
(4 )
(4 )
0.90 2.10
© NXP B.V. 2008. All rights reserved.
0.40
(6 )
sot363
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