ESDALC6V1-1BT2 STMicroelectronics, ESDALC6V1-1BT2 Datasheet - Page 8

TRANSIL ESD PROT LOW CAP SOD882

ESDALC6V1-1BT2

Manufacturer Part Number
ESDALC6V1-1BT2
Description
TRANSIL ESD PROT LOW CAP SOD882
Manufacturer
STMicroelectronics
Series
TRANSIL™r
Datasheet

Specifications of ESDALC6V1-1BT2

Voltage - Reverse Standoff (typ)
3V
Voltage - Breakdown
6.1V
Power (watts)
100W
Polarization
Bidirectional
Mounting Type
Surface Mount
Package / Case
SOD-882
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-6291-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ESDALC6V1-1BT2
Manufacturer:
STMicroelectronics
Quantity:
135
Part Number:
ESDALC6V1-1BT2
Manufacturer:
ST
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Part Number:
ESDALC6V1-1BT2
Manufacturer:
ST
Quantity:
20 000
Recommendation on PCB assembly
4.2
4.3
4.4
Note:
8/10
Placement
1.
2.
3.
4.
5.
6.
PCB design preference
1.
2.
Reflow profile
Figure 17. ST ECOPACK recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component movement.
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
Standard tolerance of ± 0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
125 °C
125 °C
220°C
220°C
180°C
180°C
0
0
0
0
3°C/s max
3°C/s max
1
1
Doc ID 13909 Rev 2
90 to 150 sec
90 to 150 sec
2
2
3
3
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
5
5
2°C/s recommended
6
6
6°C/s max
2°C/s recommended
ESDALC6V1-1BT2
6°C/s max
Time (min)
Time (min)
7
7

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