BRL3225T470K Taiyo Yuden, BRL3225T470K Datasheet - Page 9
![INDUCTOR 47UH 420MA 1210 SMD](/photos/11/89/118956/brl3225t470k_sml.jpg)
BRL3225T470K
Manufacturer Part Number
BRL3225T470K
Description
INDUCTOR 47UH 420MA 1210 SMD
Manufacturer
Taiyo Yuden
Series
BRr
Datasheet
1.BRL2518T4R7M.pdf
(9 pages)
Specifications of BRL3225T470K
Inductance
47µH
Current
390mA
Current - Saturation
420mA
Current - Temperature Rise
390mA
Tolerance
±10%
Dc Resistance (dcr)
1.2 Ohm Max
Self Resonant Freq
7MHz
Package / Case
1210 (3225 Metric)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C
Frequency - Test
100kHz
Applications
Power Supplies
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Shielding
-
Q @ Freq
-
Other names
587-2169-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BRL3225T470K
Manufacturer:
TAYIO
Quantity:
60 000
Company:
Part Number:
BRL3225T470K
Manufacturer:
TAIYO YUDEN
Quantity:
66 000
Part Number:
BRL3225T470K
Manufacturer:
TAIYO/太诱
Quantity:
20 000
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Wound Chip power inductor (BR-series)
* This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
Precautions
Precautions
Precautions
Precautions
Precautions
Precautions
Precautions
1. Circuit Design
2. PCB Design
3. Considerations for automatic placement
4. Soldering
5. Cleaning
6. Handling
7. Storage conditions
Technical
consider-
Technical
consider-
Technical
consider-
Technical
consider-
Technical
consider-
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
ations
ations
ations
ations
ations
◆Operationg Ambient
◆Land pattern design
◆Land pattern design
◆Adjustment of mounting machine
◆Adjustment of mounting machine
◆Reflow soldering
◆Lead free soldering
◆Recommended conditions for using a soldering iron (NR10050 Type)
◆Reflow soldering
◆Cleaning conditions
◆Cleaning conditions
◆Handling
◆Cutting the PC boards
◆Mechanical considerations
◆The stress for picking and placing
◆Packing
◆Cutting the PC boards
◆Mechanical considerations
◆Pick-up pressure
◆Packing
◆Storage
◆Storage
Surface Mounting
The products are premised on the usage for the general equipments like the office supply equipment, the telecommunications systems, the measuring
equipment, the household equipment and so on.
Please ask to TAIYO YUDEN's sales person in advance, if you need to apply them to the equipments or the systems which might have any influences for the
human body, the property, like the traffic systems, the safety equipment, the aerospace systems, the nuclear control systems, the medical equipment and so
on.
The products might be broken if too much stress is given for the picking and placing.
Touch a soldering iron to the land pattern not to the product directly.
The temperature of a soldering iron is less than 350degC.
The soldering is for 3 seconds or less.
1. Please refer to a recommended land pattern.
1. The conditions of the picking and placing should be checked in advence.
2. The products are only for reflow soldering.
1. Excessive fisical impact should not be imposed on the products for picking and placing onto the PC boards.
2. Mounting and soldering conditions should be checked in advance.
1. Please apply our recommended soldering conditions on the specification as much as possible.
2. The products are only for reflow soldering.
3. Please do not give any stress to a product until it returns in room temperature after reflow soldering.
1. Please check the adhesion, the solder temperature, the solderability and the shape of solder filet if the solder that is not in the specification is used.
1. The product might break or might make the tombstoning, if the soldering conditions are too far from our recommended conditions.
1. Please don't wash by the ultra-sonic waves.
1. Washing by the ultra-sonic waves might break the product.
1. Keep the product away from any magnets.
1. Please don't give any stress of the bending or the twisting for the cutting process of PC boards.
2. Please don't give any shock and stress to the products in transportation.
1. Please don't give too much shock to the product.
2. Please don't give any shock and stress to the products in transportation.
1. Please don't give any shock into an exposed ferrite core.
1. Please don't pile the packing boxes up as much as possible.
1. Please don't give the bending stress or the twisting stress to the products because they might break in such cases.
1. The mechnical shock might break the products.
2. The products might break depending on the handling in transportation.
1. The electrical characteristics of the products might be shifted by too much ficical shock and stress.
1. The products and the tape might break, if the packing boxes are piled up.
1. The packing boxes can be kept at the ambient which the temperature is from 0 to 40degC and the humidity is less than 70%.
2. Tthe ambient temperature of less than 30degC is recommended not to get the tape and the solderability worse.
3. Please solder the products by a half year after they have been shipped.
1. The ambient of high temperature or high humidity might accelerate to make the solderability and the tape worse.
Otherwise please use them after checking the solderability in advance.
300
200
100
0
150∼180
90±30sec
Heating Time 【 sec】
30±10sec
230℃ min
5sec max
Peak :
260+0/ー5℃
1 1
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