LHL16TB151K Taiyo Yuden, LHL16TB151K Datasheet - Page 17
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LHL16TB151K
Manufacturer Part Number
LHL16TB151K
Description
INDUCTOR 150UH 2.4A RADIAL
Manufacturer
Taiyo Yuden
Series
LHr
Datasheet
1.LHL08TB100K.pdf
(21 pages)
Specifications of LHL16TB151K
Inductance
150µH
Current
2.4A
Tolerance
±10%
Dc Resistance (dcr)
110 mOhm Max
Q @ Freq
60 @ 796kHz
Self Resonant Freq
2.3MHz
Package / Case
Radial
Mounting Type
Through Hole
Operating Temperature
-25°C ~ 105°C
Frequency - Test
796kHz
Applications
General Purpose
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Shielding
-
Current - Saturation
-
Current - Temperature Rise
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LHL16TB151K
Manufacturer:
TAIYO YUDEN
Quantity:
66 000
△
21.Resisitance to soldering
!
RELIABILITY DATA
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
heat
Item
No significant abnormality in ap-
pearance
FA02
Type
CAL45
Type
(LHLP:
No
significant
abnormality in
appearance
Inductance
change:
Within±5%
Q change:
Within±30%
only △L/L)
LHL□□□
Specified Value
No
significant
abnormality in
appearance
Impedance
change:
Within±20%
FBA/FBR
Refer to
individual
specification
FL05□
Type
No
significant
abnormality
in appearance
Impedance
change:
Within±20%
FL06BT
Type
△
!
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
FA・CA:
Solder temperature:260±5℃ (CP02・LA02)
Duration:5±0.5 sec. One time
Immersed conditions:Inserted into substrate witht= 1.6mm
Recovery : At least 1hr of recovery under the standard
LHL□□□:
Solder bath method
Solder temperature:260±5℃
Duration:10±1 sec.
Manual soldering
Solder temperature:350±10℃ (At the tip of soldering iron)
Duration:5±1 sec.
Caution:No excessive pressing shall be applied to terminald
Recovery : 4 to 24hrs of recovery under the standard
FB:
Solder bath method
Condition 1
Solder temperature:260±5℃
Duration:10±1 sec.
Immersion depth:Up to 1.5mm from terminal root.
Condition 2
Solder temperature:350±5℃
Duration:3±1 sec.
Immersion depth:Up to 1.5mm from terminal root.
Recovery : 3hrs of recovery under the standard condi-
FL:
Solder condition:260±5℃ 10±1 sec.
Immersion depth:Up to 0.5 to 1.0mm from terminal root.
Recovery : 3hrs of recovery under the standard condition
:Up to 1.5mm from bottom of case.
:Up to 1.5mm from bottom of case.
condition after the tset.
tion after the test.
after the test.
condition after the test, followed by the
measurement within 2hrs.
Test Method and Remarks
270±5℃ (LA03・LA04・LA45)
6/9
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