PIC12HV615-I/SN Microchip Technology, PIC12HV615-I/SN Datasheet - Page 3

• Manufacturer Part Number: PIC12HV615-I/SN
• Description: IC PIC MCU FLASH 1KX14 8SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12HV615-I/SN

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-SOIC (3.9mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12H
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS-232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
b
2
D
e
PIC12F609/615/12HV609/615
E1
A2
Dimension Limits
E
c
Units
A2
A1
E1
L1
N
D
A
E
e
L
φ
c
b
0.75
0.00
0.40
0.08
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
DS80294B-page 3
φ