PIC16F677-I/P Microchip Technology, PIC16F677-I/P Datasheet - Page 278

• Manufacturer Part Number: PIC16F677-I/P
• Description: IC PIC MCU FLASH 2KX14 20DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F677-I/P

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 20-DIP (0.300", 7.62mm)
• Mfg Application Notes: Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 18
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162061 - HEADER INTRFC MPLAB ICD2 20PINACICE0203 - MPLABICE 20P 300 MIL ADAPTER
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F631/677/685/687/689/690
19.2
The following sections give the technical details of the packages.
20-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
DS41262C-page 276
Package Details
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
eB
E1
E
Dimension Limits
§
2
1
D
c
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
A1
A
MIN
1.025
Preliminary
.140
.115
.015
.295
.240
.120
.008
.055
.014
.310
5
5
INCHES*
B
B1
NOM
20
1.033
.100
.155
.130
.310
.250
.130
.012
.060
.018
.370
10
10
MAX
1.040
.170
.145
.325
.260
.140
.015
.065
.022
.430
15
15
MIN
26.04
3.56
2.92
0.38
7.49
6.10
3.05
0.20
1.40
0.36
7.87
5
5
MILLIMETERS
p
© 2006 Microchip Technology Inc.
NOM
20
26.24
2.54
3.94
3.30
7.87
6.35
3.30
0.29
1.52
0.46
9.40
A2
10
10
L
MAX
26.42
10.92
4.32
3.68
8.26
6.60
3.56
0.38
1.65
0.56
15
15