PIC16F689-I/SO Microchip Technology, PIC16F689-I/SO Datasheet - Page 278
PIC16F689-I/SO
Manufacturer Part Number
PIC16F689-I/SO
Description
IC PIC MCU FLASH 4KX14 20SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F690DM-PCTLHS.pdf
(306 pages)
3.PIC16F677-IP.pdf
(2 pages)
4.PIC16F677-IP.pdf
(16 pages)
5.PIC16F677-ISO.pdf
(294 pages)
Specifications of PIC16F689-I/SO
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
20-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
18
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C/SPI/SSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
17
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163029, DM164120
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SO1-1 - SOCKET TRANS ICE 20DIP TO 20SOICXLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILXLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC164039 - MODULE SKT PROMATE II 20DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F690DM-PCTLHS PDF datasheet #2
- PIC16F677-IP PDF datasheet #3
- PIC16F677-IP PDF datasheet #4
- PIC16F677-ISO PDF datasheet #5
- Current page: 278 of 294
- Download datasheet (6Mb)
PIC16F631/677/685/687/689/690
19.2
The following sections give the technical details of the packages.
20-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
DS41262C-page 276
Package Details
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
eB
E1
E
Dimension Limits
§
2
1
D
c
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
A1
A
MIN
1.025
Preliminary
.140
.115
.015
.295
.240
.120
.008
.055
.014
.310
5
5
INCHES*
B
B1
NOM
20
1.033
.100
.155
.130
.310
.250
.130
.012
.060
.018
.370
10
10
MAX
1.040
.170
.145
.325
.260
.140
.015
.065
.022
.430
15
15
MIN
26.04
3.56
2.92
0.38
7.49
6.10
3.05
0.20
1.40
0.36
7.87
5
5
MILLIMETERS
p
© 2006 Microchip Technology Inc.
NOM
20
26.24
2.54
3.94
3.30
7.87
6.35
3.30
0.29
1.52
0.46
9.40
A2
10
10
L
MAX
26.42
10.92
4.32
3.68
8.26
6.60
3.56
0.38
1.65
0.56
15
15
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