PIC18F14K22-I/P Microchip Technology, PIC18F14K22-I/P Datasheet - Page 347
![IC PIC MCU FLASH 512KX16 20-PDIP](/photos/12/13/121303/150-20-dip_sml.jpg)
PIC18F14K22-I/P
Manufacturer Part Number
PIC18F14K22-I/P
Description
IC PIC MCU FLASH 512KX16 20-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC18LF13K22-ISS.pdf
(388 pages)
3.PIC18LF13K22-ISS.pdf
(12 pages)
4.PIC18LF13K22-ISS.pdf
(36 pages)
5.PIC18F13K22-ISS.pdf
(382 pages)
Specifications of PIC18F14K22-I/P
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, MSSP, SPI, USART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Package
20PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC16F722-ISS PDF datasheet
- PIC18LF13K22-ISS PDF datasheet #2
- PIC18LF13K22-ISS PDF datasheet #3
- PIC18LF13K22-ISS PDF datasheet #4
- PIC18F13K22-ISS PDF datasheet #5
- Current page: 347 of 388
- Download datasheet (4Mb)
25.11 Thermal Considerations
2010 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1:
Param
No.
2:
3:
T
PD
P
P
P
JA
JC
JMAX
INTERNAL
I
DER
/
O
Sym.
TBD = To Be Determined
I
T
T
DD
A
J
= Ambient Temperature.
= Junction Temperature.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
+125°C
Preliminary
PIC18F1XK22/LF1XK22
108.1
Typ.
62.4
85.2
31.4
150
2.5
40
24
24
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + (I
- T
DD
I
/
O
A
DS41365D-page 347
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))
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