PIC18LF14K50-I/P Microchip Technology, PIC18LF14K50-I/P Datasheet - Page 333
![IC PIC MCU FLASH 16KX10 20-PDIP](/photos/12/13/121303/150-20-dip_sml.jpg)
PIC18LF14K50-I/P
Manufacturer Part Number
PIC18LF14K50-I/P
Description
IC PIC MCU FLASH 16KX10 20-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F13K50-ISS.pdf
(420 pages)
2.PIC18F13K50-ISS.pdf
(40 pages)
3.PIC18F13K50-ISS.pdf
(10 pages)
4.PIC18F13K50-ISS.pdf
(2 pages)
5.PIC18F14K50-IP.pdf
(422 pages)
Specifications of PIC18LF14K50-I/P
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART/I2C/MSSP/SPI/USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
15
Number Of Timers
4
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF14K50-I/P
Manufacturer:
Microchip
Quantity:
450
- PIC18F13K50-ISS PDF datasheet
- PIC18F13K50-ISS PDF datasheet #2
- PIC18F13K50-ISS PDF datasheet #3
- PIC18F13K50-ISS PDF datasheet #4
- PIC18F14K50-IP PDF datasheet #5
- Current page: 333 of 420
- Download datasheet (4Mb)
LFSR
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
2010 Microchip Technology Inc.
Q Cycle Activity:
After Instruction
Decode
Decode
FSR2H
FSR2L
Q1
Read literal
Read literal
Load FSR
LFSR f, k
0 f 2
0 k 4095
k FSRf
None
File Select Register pointed to by ‘f’.
2
2
The 12-bit literal ‘k’ is loaded into the
‘k’ MSB
‘k’ LSB
LFSR 2, 3ABh
1110
1111
Q2
=
=
03h
ABh
1110
0000
Process
Process
Data
Data
Q3
k
00ff
7
kkk
‘k’ to FSRfL
Write literal
literal ‘k’
MSB to
FSRfH
Write
k
Q4
kkkk
11
kkk
Preliminary
MOVF
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
REG
W
REG
W
Q1
PIC18F/LF1XK50
register ‘f’
Move f
MOVF
0 f 255
d [0,1]
a [0,1]
f dest
N, Z
The contents of register ‘f’ are moved to
a destination dependent upon the
status of ‘d’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed back in register ‘f’ (default).
Location ‘f’ can be anywhere in the
256-byte bank.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank (default).
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode”
1
1
MOVF
Read
0101
Q2
=
=
=
=
22h
FFh
22h
22h
f {,d {,a}}
REG, 0, 0
00da
Process
Data
Q3
DS41350E-page 333
ffff
for details.
Write W
Q4
ffff
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