PIC24HJ12GP201-I/SO Microchip Technology, PIC24HJ12GP201-I/SO Datasheet - Page 226
![IC PIC MCU FLASH 4KX24 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC24HJ12GP201-I/SO
Manufacturer Part Number
PIC24HJ12GP201-I/SO
Description
IC PIC MCU FLASH 4KX24 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(242 pages)
2.PIC24HJ12GP201-ISO.pdf
(8 pages)
3.PIC24HJ12GP201-ISO.pdf
(84 pages)
4.PIC24HJ12GP201-ISO.pdf
(12 pages)
5.PIC24HJ12GP201-IP.pdf
(234 pages)
Specifications of PIC24HJ12GP201-I/SO
Program Memory Type
FLASH
Program Memory Size
12KB (4K x 24)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
1 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit or 6-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164339 - MODULE SKT FOR PM3 28SOIC
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ12GP201-I/SO
Manufacturer:
MICROCHIP
Quantity:
4 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ12GP201-ISO PDF datasheet #2
- PIC24HJ12GP201-ISO PDF datasheet #3
- PIC24HJ12GP201-ISO PDF datasheet #4
- PIC24HJ12GP201-IP PDF datasheet #5
- Current page: 226 of 242
- Download datasheet (4Mb)
PIC24HJ12GP201/202
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS70282D-page 224
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
Preliminary
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
2
1
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
© 2009 Microchip Technology Inc.
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
b
K
e
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