PIC18F1320-I/P Microchip Technology, PIC18F1320-I/P Datasheet

PIC18F1320-I/P

Manufacturer Part Number

PIC18F1320-I/P

Description

IC MCU FLASH 4KX16 A/D 18-DIP

Manufacturer

Microchip Technology

Series

PIC® 18Fr

Datasheets

1.PIC16F616T-ISL.pdf (8 pages)

2.PIC18F1220-ISO.pdf (308 pages)

3.PIC18F1220-ISO.pdf (8 pages)

4.PIC18F1220-ISO.pdf (6 pages)

5.PIC18F1220-ISO.pdf (10 pages)

6.PIC18F1220-ISO.pdf (4 pages)

7.PIC18F1320-ISS.pdf (36 pages)

8.PIC18F1220-EP.pdf (310 pages)

Specifications of PIC18F1320-I/P

Program Memory Type

FLASH

Program Memory Size

8KB (4K x 16)

Package / Case

18-DIP (0.300", 7.62mm)

Core Processor

PIC

Core Size

8-Bit

Speed

40MHz

Connectivity

UART/USART

Peripherals

Brown-out Detect/Reset, LVD, POR, PWM, WDT

Number Of I /o

Eeprom Size

256 x 8

Ram Size

256 x 8

Voltage - Supply (vcc/vdd)

4.2 V ~ 5.5 V

Data Converters

A/D 7x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C

Processor Series

PIC18F

Core

PIC

Data Bus Width

8 bit

Data Ram Size

256 B

Interface Type

EUSART

Maximum Clock Frequency

40 MHz

Number Of Programmable I/os

Number Of Timers

Operating Supply Voltage

2 V to 5.5 V

Maximum Operating Temperature

+ 85 C

Mounting Style

Through Hole

3rd Party Development Tools

52715-96, 52716-328, 52717-734, 52712-325, EWPIC18

Development Tools By Supplier

PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136

Minimum Operating Temperature

- 40 C

On-chip Adc

7-ch x 10-bit

Package

18PDIP

Device Core

PIC

Family Name

PIC18

Maximum Speed

40 MHz

Data Rom Size

256 B

Height

3.3 mm

Length

22.86 mm

Supply Voltage (max)

5.5 V

Supply Voltage (min)

4.2 V

Width

6.35 mm

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

For Use With

DVA18XP180 - DEVICE ADAPTER 18F1320 PDIP 18LDACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

PIC18F1320-I/P

Manufacturer:

Microchip Technology

Quantity:

1 809

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

PIC18F1320-I/P

Manufacturer:

Quantity:

Company:

Meier Automation Equipment Co., Limited

Part Number:

PIC18F1320-I/P

Manufacturer:

MICROCHI

Quantity:

20 000

Current page: 1 of 6
Download datasheet (184Kb)

The PIC18F1220/1320 Rev. B4 parts you have

received conform functionally to the Device Data Sheet

(DS39605C), except for the anomalies described

below.

All of the issues listed here will be addressed in future

revisions of the PIC18F1220/1320 silicon.

The

PIC18F1220/1320 devices with these Device/

Revision IDs:

1. Module: Core (DAW Instruction)

EXAMPLE 1:

The Device IDs (DEVID1 and DEVID2) are located at

addresses

configuration space. They are shown in hexadecimal

in the format “DEVID2 DEVID1”.

MOVLW

ADDLW

BTFSC

INCFSZ byte2

DAW

BTFSC

INCFSZ byte2

This is repeated for each DAW instruction.

Part Number

PIC18F1220

PIC18F1320

The DAW instruction may improperly clear the

Carry bit (STATUS<0>) when executed.

Work around

Test the Carry bit state before executing the DAW

instruction. If the Carry bit is set, increment the

next higher byte to be added, using an instruction

such as INCFSZ (this instruction does not affect

any Status flags and will not overflow a BCD nib-

ble). After the DAW instruction has been executed,

process the Carry bit normally (see Example 1).

Date Codes that pertain to this issue:

All engineering and production devices.

following

PIC18F1220/1320 Rev. B4 Silicon/Data Sheet Errata

0x80

STATUS, C

3FFFFEh:3FFFFFh

silicon

PROCESSING THE CARRY

BIT DURING BCD ADDITIONS

00 0111 111

00 0111 110

Device ID

; .80 (BCD)

; test C

; inc next higher LSB

; test C

; inc next higher LSB

errata apply

Revision ID

the

00100

PIC18F1220/1320

only

device’s

2. Module: EUSART

3. Module: Data EEPROM

The auto-baud measurement may not determine

the correct baud rate if the ABDEN bit is set while

the RB4/RX pin is low.

Work around

If the wake-up function is being used (WUE is set),

wait for the RB4/RX pin to go high following a

Break signal before setting the ABDEN bit.

If the wake-up function is not being used, ensure

that RB4/RX is Idle (high between bytes) before

setting the ABDEN bit.

Date Codes that pertain to this issue:

All engineering and production devices.

When writing to the data EEPROM, the contents of

the data EEPROM memory may not be written as

expected.

Work around

Either of two work arounds can be used:

1. Before beginning any writes to the data

2. Configure the BOR as enabled (any voltage).

Date Codes that pertain to this issue:

All engineering and production devices.

EEPROM, enable the LVD (any voltage) and

wait for the internal voltage reference to

become stable. LVD interrupt requests may be

ignored. Once the LVD voltage reference is

stable, perform all EEPROM writes normally.

When writes have been completed, the LVD

may be disabled.

Select a threshold below V

operation. If V

the device will be held in Brown-out Reset.

is below the BOR threshold,

DS80175E-page 1

to allow normal

Related parts for PIC18F1320-I/P

PIC18F1320-I/P Summary of contents

Page 1

... PIC18F1220/1320 devices with these Device/ Revision IDs: Part Number Device ID PIC18F1220 00 0111 111 PIC18F1320 00 0111 110 The Device IDs (DEVID1 and DEVID2) are located at addresses 3FFFFEh:3FFFFFh in configuration space. They are shown in hexadecimal in the format “DEVID2 DEVID1”. 1. Module: Core (DAW Instruction) The DAW instruction may improperly clear the Carry bit (STATUS< ...

Page 2

... Affected systems will repeatably fail normal testing. Systems not affected will continue to not be affected over time. Work around Insert a NOP instruction at address 0x0000. Date Codes that pertain to this issue: All engineering and production devices. © 2005 Microchip Technology Inc. ...

Page 3

... The new value is 5.5 ms and is shown in bold below. TABLE 22-1: MEMORY PROGRAMMING REQUIREMENTS DC CHARACTERISTICS Param Sym Characteristic No. D122 T Erase/Write Cycle Time DEW © 2005 Microchip Technology Inc. PIC18F1220/1320 definition for R/W-0 R/W-0 R/W-0 T3CKPS1 T3CKPS0 T3CCP1 ) has DEW Standard Operating Conditions (unless otherwise stated) Operating temperature -40° ...

Page 4

... Sheet Clarification issues with the exception of former issue 3 (Timer1 Oscillator and In-Circuit Serial Programming™), now numbered issue 1 and added issue 2 (CCP). Rev E Document (08/2005) Removed Data Sheet Clarification issue 1 and added issue 2 (Data EEPROM Memory). DS80175E-page 4 © 2005 Microchip Technology Inc. ...

Page 5

... PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

Page 6

... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2005 Microchip Technology Inc. EUROPE Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...

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