PIC18F2321-I/ML Microchip Technology, PIC18F2321-I/ML Datasheet - Page 12
![IC PIC MCU FLASH 4KX16 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC18F2321-I/ML
Manufacturer Part Number
PIC18F2321-I/ML
Description
IC PIC MCU FLASH 4KX16 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(402 pages)
3.PIC18F2221-ISO.pdf
(8 pages)
4.PIC18F2221-ISO.pdf
(30 pages)
5.PIC18F2221-ISO.pdf
(46 pages)
6.PIC18F2321-IML.pdf
(396 pages)
Specifications of PIC18F2321-I/ML
Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28QFN EP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28QFN4 - SOCKET TRANS ICE 28QFN W/CABLEAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F2221/2321/4221/4321
10. Module: Packaging Information
DS80310G-page 12
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
The 28-Lead Plastic Quad Flat, No Lead Package
(MM) illustration, on page 371, is replaced by the
one shown.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
D
e
A
E
L
K
b
E2
2
1
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
28
D2
–
Microchip Technology Drawing C04-105B
© 2008 Microchip Technology Inc.
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
b
K
e