PIC16F870-I/SS Microchip Technology, PIC16F870-I/SS Datasheet - Page 153
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PIC16F870-I/SS
Manufacturer Part Number
PIC16F870-I/SS
Description
IC MCU FLASH 2KX14 EE 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F870-ISO.pdf
(172 pages)
4.PIC16F870-ISO.pdf
(6 pages)
Specifications of PIC16F870-I/SS
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
64Byte
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
28 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB16F871 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC164020 - MODULE SKT PROMATEII 44TQFPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F870-I/SS
Manufacturer:
EPCOS
Quantity:
1 000
Part Number:
PIC16F870-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
2003 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
D
p
A
E
L
B
n
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
PIC16F870/871
MIN
34.16
3.56
3.18
0.38
6.99
3.18
0.20
8.13
7.62
1.02
0.41
5
5
MILLIMETERS
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
DS30569B-page 151
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15