PIC16F870-I/SS Microchip Technology, PIC16F870-I/SS Datasheet - Page 154
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PIC16F870-I/SS
Manufacturer Part Number
PIC16F870-I/SS
Description
IC MCU FLASH 2KX14 EE 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F870-ISO.pdf
(172 pages)
4.PIC16F870-ISO.pdf
(6 pages)
Specifications of PIC16F870-I/SS
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
64Byte
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
28 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB16F871 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC164020 - MODULE SKT PROMATEII 44TQFPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F870-I/SS
Manufacturer:
EPCOS
Quantity:
1 000
Part Number:
PIC16F870-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F870/871
28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
DS30569B-page 152
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
2003 Microchip Technology Inc.
NOM
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
28
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8