DSPIC30F3012-30I/P Microchip Technology, DSPIC30F3012-30I/P Datasheet - Page 225
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DSPIC30F3012-30I/P
Manufacturer Part Number
DSPIC30F3012-30I/P
Description
IC DSPIC MCU/DSP 24K 18DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F2011-20IP.pdf
(26 pages)
4.DSPIC30F3012-20ISO.pdf
(14 pages)
5.DSPIC30F3012-20ISO.pdf
(20 pages)
6.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3012-30I/P
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F3012-30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
Microchip Technology
Quantity:
1 936
Company:
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
TI
Quantity:
6
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F3012-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
28-Lead Plastic Quad Flat No Lead Package 6x6x0.9 mm Body (QFN-S) –
With 0.40 mm Contact Length (Saw Singulated)
2004 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Standoff
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Lead Width
Lead Length
Drawing No. C04-124
A1
*Controlling Parameter
Notes:
JEDEC equivalent: MO-220
TOP VIEW
Dimension Limits
E
Units
E2
D2
A1
E
D
n
e
A
b
L
OPTIONAL
INDEX
AREA
MIN
D
.031
.000
.232
.169
.232
.169
.013
.012
Preliminary
EXPOSED
METAL
INDICATORS
A
ALTERNATE
INCHES
.026 BSC
PAD
NOM
D2
28
INDEX
.035
.001
.236
.175
.236
.175
.015
.016
2
1
MAX
n
.039
.002
.240
.177
.240
.177
.017
.020
BOTTOM VIEW
E2
MIN
0.80
0.00
5.90
4.30
5.90
4.30
0.33
0.30
MILLIMETERS*
0.65 BSC
NOM
dsPIC30F
28
Revised 05/24/04
L
0.90
0.02
6.00
4.45
6.00
4.45
0.38
0.40
DS70082G-page 223
b
e
MAX
1.00
0.05
6.10
4.50
6.10
4.50
0.43
0.50