DSPIC30F3012-30I/P Microchip Technology, DSPIC30F3012-30I/P Datasheet - Page 62
![IC DSPIC MCU/DSP 24K 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
DSPIC30F3012-30I/P
Manufacturer Part Number
DSPIC30F3012-30I/P
Description
IC DSPIC MCU/DSP 24K 18DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F2011-20IP.pdf
(26 pages)
4.DSPIC30F3012-20ISO.pdf
(14 pages)
5.DSPIC30F3012-20ISO.pdf
(20 pages)
6.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3012-30I/P
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F3012-30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
Microchip Technology
Quantity:
1 936
Company:
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
TI
Quantity:
6
Part Number:
DSPIC30F3012-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F3012-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F
6.6.3
Example 6-2 shows a sequence of instructions that
can be used to load the 96 bytes of write latches.
Thirty-two TBLWTL and32 TBLWTH instructions are
needed to load the write latches selected by the table
pointer.
EXAMPLE 6-2:
DS70082G-page 60
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
; Perform the TBLWT instructions to write the latches
; 0th_program_word
; 1st_program_word
;
; 31st_program_word
Note: In Example 6-2, the contents of the upper byte of W3 has no effect.
2nd_program_word
MOV
MOV
MOV
MOV
MOV
TBLWTL W2
TBLWTH W3
MOV
MOV
TBLWTL W2
TBLWTH W3
MOV
MOV
TBLWTL W2
TBLWTH W3
•
•
•
MOV
MOV
TBLWTL W2
TBLWTH W3
LOADING WRITE LATCHES
#0x0000,W0
W0
#0x6000,W0
#LOW_WORD_0,W2
#HIGH_BYTE_0,W3
#LOW_WORD_1,W2
#HIGH_BYTE_1,W3
#LOW_WORD_2,W2
#HIGH_BYTE_2,W3
#LOW_WORD_3,W2
#HIGH_BYTE_3,W3
,
,
,
,
,
,
,
,
,
LOADING WRITE LATCHES
TBLPAG
[W0]
[W0++]
[W0]
[W0++]
[W0]
[W0++]
[W0]
[W0++]
Preliminary
;
; Initialize PM Page Boundary SFR
; An example program memory address
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
2004 Microchip Technology Inc.