DSPIC30F3013-30I/SP Microchip Technology, DSPIC30F3013-30I/SP Datasheet - Page 209
DSPIC30F3013-30I/SP
Manufacturer Part Number
DSPIC30F3013-30I/SP
Description
IC DSPIC MCU/DSP 24K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F3012-20ISO.pdf
(14 pages)
4.DSPIC30F3012-20ISO.pdf
(20 pages)
5.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3013-30I/SP
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301330ISP
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20ISO PDF datasheet #2
- DSPIC30F3012-20ISO PDF datasheet #3
- DSPIC30F3012-20ISO PDF datasheet #4
- DSPIC30F3014-30IP PDF datasheet #5
- Current page: 209 of 244
- Download datasheet (7Mb)
FIGURE 24-18:
TABLE 24-30: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
2004 Microchip Technology Inc.
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP36
SP40
SP41
Note 1:
Param
No.
Note: Refer to Figure 24-3 for load conditions.
(CKP = 0)
(CKP = 1)
SDI
SCK
SDO
SCK
2:
3:
4:
X
X
X
X
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdoV2sc,
TdoV2scL
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
Symbol
SP36
SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
SDO
first SCK
Setup time of SDI
to SCK
Hold time of SDI
to SCK
SP40
X
X
X
X
X
MSb IN
X
X
X
X
Characteristic
output low time
output high time
output fall time
output rise time
edge
data output fall time
data output rise time
data output valid after
data output setup to
MSb
X
X
SP11
SP41
X
edge
edge
edge
SP30,SP31
SP35
X
X
SP10
data input
data input
(4)
(1)
(3)
(4)
(3)
BIT14 - - - - - -1
BIT14 - - - -1
(4)
(4)
Preliminary
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
T
T
CY
CY
Min
—
—
—
—
—
30
20
20
/ 2
/ 2
SP21
SP20
Typ
LSb IN
10
10
10
10
—
—
—
—
—
—
LSb
(2)
SP20
SP21
-40°C ≤ T
-40°C ≤ T
Max
25
25
25
25
30
—
—
—
—
—
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
Units
dsPIC30F
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
DS70082G-page 207
Conditions
—
—
—
—
—
—
—
—
—
—
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