DSPIC30F3010-30I/SO Microchip Technology, DSPIC30F3010-30I/SO Datasheet - Page 229
DSPIC30F3010-30I/SO
Manufacturer Part Number
DSPIC30F3010-30I/SO
Description
IC DSPIC MCU/DSP 24K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F3010-30ISO.pdf
(228 pages)
2.DSPIC30F3010-30ISO.pdf
(18 pages)
3.DSPIC30F3010-30ISO.pdf
(6 pages)
4.DSPIC30F3010-30ISO.pdf
(16 pages)
5.DSPIC30F3010-30ISO.pdf
(22 pages)
6.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3010-30I/SO
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Data Ram Size
1 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301030ISO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3010-30I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F3010-30ISO PDF datasheet
- DSPIC30F3010-30ISO PDF datasheet #2
- DSPIC30F3010-30ISO PDF datasheet #3
- DSPIC30F3010-30ISO PDF datasheet #4
- DSPIC30F3010-30ISO PDF datasheet #5
- DSPIC30F3014-30IP PDF datasheet #6
- Current page: 229 of 244
- Download datasheet (7Mb)
44-Lead Plastic Thin Quad Flatpack 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
2004 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
β
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
n1
A1
E1
A
E
D
B
n
p
L
φ
c
α
β
n
MIN
Preliminary
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
φ
D1
0
5
5
L
CH x 45 °
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
MILLIMETERS*
0
5
5
NOM
12.00
12.00
10.00
10.00
0.80
1.10
1.00
0.10
0.60
0.15
0.38
0.89
dsPIC30F
3.5
44
10
10
11
A2
DS70082G-page 227
MAX
α
12.25
12.25
10.10
10.10
1.05
0.15
0.75
0.44
1.14
1.20
0.20
15
15
7
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