DSPIC33FJ64GP202-I/MM Microchip Technology, DSPIC33FJ64GP202-I/MM Datasheet - Page 388
![IC DSPIC MCU/DSP 64K 28-QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
DSPIC33FJ64GP202-I/MM
Manufacturer Part Number
DSPIC33FJ64GP202-I/MM
Description
IC DSPIC MCU/DSP 64K 28-QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
Specifications of DSPIC33FJ64GP202-I/MM
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
28-QFN
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
8 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- Current page: 388 of 412
- Download datasheet (6Mb)
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]
with 0.40 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS70292E-page 388
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
A1
E
A
EXPOSED
NOTE 1
Units
A1
A3
E2
D2
PAD
N
A
E
D
K
e
b
L
E2
1
2
0.80
0.00
3.65
3.65
0.23
0.30
0.20
MIN
N
BOTTOM VIEW
MILLIMETERS
0.65 BSC
6.00 BSC
6.00 BSC
0.20 REF
NOM
0.90
0.02
3.70
3.70
0.38
0.40
28
D2
–
Microchip Technology Drawing C04-124B
© 2011 Microchip Technology Inc.
MAX
1.00
0.05
4.70
4.70
0.43
0.50
–
L
b
e
K
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