PIC16C65B-20/P Microchip Technology, PIC16C65B-20/P Datasheet - Page 3
![IC MCU OTP 4KX14 PWM 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16C65B-20/P
Manufacturer Part Number
PIC16C65B-20/P
Description
IC MCU OTP 4KX14 PWM 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F818-ISO.pdf
(6 pages)
2.PIC16C63A-04SP.pdf
(184 pages)
3.PIC16C63A-04SP.pdf
(10 pages)
4.PIC16C63A-04SP.pdf
(10 pages)
5.PIC16C65B-04P.pdf
(7 pages)
Specifications of PIC16C65B-20/P
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
33
Program Memory Type
OTP
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16C
No. Of I/o's
33
Ram Memory Size
192Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
0 C
Height
3.81 mm
Length
52.26 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
3.65 V
Width
13.84 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C65B-20/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
PIC16C65B-20/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
2. Module: Packaging (Pinout and Product
FIGURE 2:
FIGURE 3:
2003 Microchip Technology Inc.
PIC16C63A and PIC16C73B devices are now
offered in 28-pin near chip scale micro lead frame
packages (commonly known as “QFN”). This
packaging type has been added to the product line
since the latest revision of the Device Data Sheet.
The addition of this option requires the following
additions to the Device Data Sheet (DS30605C).
The referenced figures and tables follow this text.
1. The “Pin Diagram” on page 2 of the Data Sheet
is amended with the addition of the 28-pin QFN
pinout, shown in Figure 2.
QFN (28-pin)
Identification)
PINOUT DIAGRAM FOR PIC16C63A AND PIC16C73B, 28-PIN QFN
PACKAGE MARKING TEMPLATE FOR PIC16C63A AND PIC16C73B, 28-PIN QFN
28-Lead QFN
RA3/AN3/V
YYWWNNN
XXXXXXXX
XXXXXXXX
RA5/AN4/SS
OSC2/CLKO
OSC1/CLKI
RA4/T0CKI
RA2/AN2
REF
V
SS
+
1
2
3
4
5
6
7
28
8 9
27
PIC16C63A
PIC16C73B
PIC16C63A/65B/73B/74B
26
10 11
25
12 13 14
24
23
22
2. Table 3-1 of Section 3.0 (“Architectural
3. Section 18.1 (“Package Marking Information”)
4. Section 18.0 (“Packaging Information”) is
5. Table B-1 (“Device Differences”) is amended to
21
20
19
18
17
16
15
Overview”) is replaced with an updated version
that adds a column for QFN pin assignments.
All new information is indicated in bold.
is amended to include a marking template and
example for 28-pin QFN devices. These are
shown in Figure 3.
amended to include the mechanical drawings
of the 28-pin QFN package. These are shown
in Figure 4 and Figure 5, respectively.
include the 28-pin QFN for the PIC16C63A and
PIC16C73B devices.
RB3
RB2
RB1
RB0/INT
V
V
RC7/RX/DT
DD
SS
Example
-I/ML
0310017
PIC16C63A
DS80048C-page 3