PIC16C65B-20/P Microchip Technology, PIC16C65B-20/P Datasheet - Page 5
![IC MCU OTP 4KX14 PWM 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16C65B-20/P
Manufacturer Part Number
PIC16C65B-20/P
Description
IC MCU OTP 4KX14 PWM 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F818-ISO.pdf
(6 pages)
2.PIC16C63A-04SP.pdf
(184 pages)
3.PIC16C63A-04SP.pdf
(10 pages)
4.PIC16C63A-04SP.pdf
(10 pages)
5.PIC16C65B-04P.pdf
(7 pages)
Specifications of PIC16C65B-20/P
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
33
Program Memory Type
OTP
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16C
No. Of I/o's
33
Ram Memory Size
192Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
0 C
Height
3.81 mm
Length
52.26 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
3.65 V
Width
13.84 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C65B-20/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
PIC16C65B-20/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
FIGURE 4:
2003 Microchip Technology Inc.
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
Drawing No. C04-114
A1
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: mMO-220
CH X 45°
28-PIN QFN PACKAGE (DRAWING 1, PACKAGING)
α
TOP VIEW
Dimension Limits
E1
E
Units
CH
D1
D2
A2
A1
A3
E1
E2
n
A
E
D
B
R
Q
α
n
p
L
2
1
MIN
A2
D1
.000
.140
.140
.009
.020
.005
.012
.009
A3
PIC16C63A/65B/73B/74B
D
A
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
.008 REF
NOM
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
D2
28
R
MAX
EXPOSED
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
12°
METAL
PADS
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
MILLIMETERS*
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
0.20 REF
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
28
DS80048C-page 5
MAX
Q
B
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
p
12°