PIC18F2520-I/SO Microchip Technology, PIC18F2520-I/SO Datasheet - Page 367

• Manufacturer Part Number: PIC18F2520-I/SO
• Description: IC MCU FLASH 16KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2520-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: MSSP/SPI/I2C/PSP/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILMCP3909RD-3PH1 - REF DESIGN MCP3909 3PH ENGY MTR
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

28.2
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Package Details
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
D
p
A
E
L
B
n
c
PIC18F2420/2520/4420/4520
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
Preliminary
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
6.99
3.18
0.20
8.13
7.62
1.02
0.41
5
5
MILLIMETERS
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
DS39631A-page 365
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15