PIC24HJ128GP202-I/SP Microchip Technology, PIC24HJ128GP202-I/SP Datasheet - Page 15
![IC PIC MCU FLASH 128K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC24HJ128GP202-I/SP
Manufacturer Part Number
PIC24HJ128GP202-I/SP
Description
IC PIC MCU FLASH 128K 28DIP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP302-ISO.pdf
(368 pages)
3.PIC24HJ32GP302-ISO.pdf
(8 pages)
4.PIC24HJ32GP302-ISO.pdf
(12 pages)
5.PIC24HJ32GP304-EML.pdf
(356 pages)
Specifications of PIC24HJ128GP202-I/SP
Program Memory Type
FLASH
Program Memory Size
128KB (43K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit or 10-ch x 12-bit
Controller Family/series
PIC24
No. Of I/o's
21
Ram Memory Size
8KB
Cpu Speed
40MIPS
No. Of Timers
7
Embedded Interface Type
I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164337 - MODULE SOCKET FOR PM3 40DIP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP302-ISO PDF datasheet #2
- PIC24HJ32GP302-ISO PDF datasheet #3
- PIC24HJ32GP302-ISO PDF datasheet #4
- PIC24HJ32GP304-EML PDF datasheet #5
- Current page: 15 of 356
- Download datasheet (6Mb)
2.0
2.1
Getting started with the PIC24HJ32GP302/304,
PIC24HJ64GPX02/X04 and PIC24HJ128GPX02/X04
family of 16-bit Microcontrollers (MCUs) requires
attention to a minimal set of device pin connections
before proceeding with development. The following is a
list of pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2009 Microchip Technology Inc.
(see Section 2.2 “Decoupling Capacitors”)
is not used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
CAP
REF
DD
+/V
/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of
PIC24HJ64GPX02/X04
PIC24HJ128GPX02/X04
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the “dsPIC33F/PIC24H
Family Reference Manual”. Please see
the
(www.microchip.com)
dsPIC33F/PIC24H
Manual sections.
described in this section may not be avail-
able on all devices. Refer to Section 4.0
“Memory Organization” in this data
sheet for device-specific register and bit
information.
- pins used when external voltage
CAP
SS
SS
pins
/V
the
DD
DDCORE
pins (regardless if ADC module
Microchip
and AV
)”)
PIC24HJ32GP302/304,
SS
Family
for
pins must be
web
family
the
Reference
latest
and
site
Preliminary
of
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70293D-page 15
SS
, AV
DD
and
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