PIC18F2523-I/SO Microchip Technology, PIC18F2523-I/SO Datasheet - Page 372

• Manufacturer Part Number: PIC18F2523-I/SO
• Description: IC PIC MCU FLASH 16KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2523-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 12-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163025 - PIC DEM FULL SPEED USB DEMO BRD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
PIC18F2423/2523/4423/4523
DS39755B-page 370
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
e
A2
1.980
.125
.015
.590
.485
.008
.030
.014
MIN
.115
E1
–
–
L
.100 BSC
INCHES
NOM
40
Microchip Technology Drawing C04-016B
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–
–
–
–
–
–
–
–
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© 2007 Microchip Technology Inc.
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
c