PIC18F2525-I/SO Microchip Technology, PIC18F2525-I/SO Datasheet - Page 201
![IC MCU FLASH 24KX16 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18F2525-I/SO
Manufacturer Part Number
PIC18F2525-I/SO
Description
IC MCU FLASH 24KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2525-ISO.pdf
(412 pages)
3.PIC18F2525-ISO.pdf
(18 pages)
4.PIC18F2525-ISO.pdf
(18 pages)
5.PIC18F2525-ISO.pdf
(6 pages)
6.PIC18F2525-ISO.pdf
(6 pages)
7.PIC18LF4620-IP.pdf
(390 pages)
Specifications of PIC18F2525-I/SO
Program Memory Type
FLASH
Program Memory Size
48KB (24K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18F4620 - BOARD DAUGHTER ICEPIC3
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2525-I/SO
Manufacturer:
HITTITE
Quantity:
101
- PIC18F2221-ISO PDF datasheet
- PIC18F2525-ISO PDF datasheet #2
- PIC18F2525-ISO PDF datasheet #3
- PIC18F2525-ISO PDF datasheet #4
- PIC18F2525-ISO PDF datasheet #5
- PIC18F2525-ISO PDF datasheet #6
- PIC18LF4620-IP PDF datasheet #7
- Current page: 201 of 390
- Download datasheet (7Mb)
17.4.17.3
Bus collision occurs during a Stop condition if:
a)
b)
FIGURE 17-31:
FIGURE 17-32:
2004 Microchip Technology Inc.
After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
SDA
SCL
PEN
BCLIF
P
SSPIF
SDA
SCL
PEN
BCLIF
P
SSPIF
Bus Collision During a Stop
Condition
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA asserted low
Assert SDA
T
BRG
T
BRG
PIC18F2525/2620/4525/4620
Preliminary
T
BRG
T
BRG
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 17-31). If the SCL pin is
sampled low before SDA is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 17-32).
SCL goes low before SDA goes high,
set BCLIF
T
BRG
T
BRG
SDA sampled
low after T
set BCLIF
‘0’
‘0’
DS39626B-page 199
‘0’
‘0’
BRG
,
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