PIC18F2320-I/SP Microchip Technology, PIC18F2320-I/SP Datasheet - Page 195
PIC18F2320-I/SP
Manufacturer Part Number
PIC18F2320-I/SP
Description
IC MCU FLASH 4KX16 EEPROM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F1320-ISS.pdf
(36 pages)
3.PIC18F2220-ISO.pdf
(394 pages)
4.PIC18F2220-ISO.pdf
(6 pages)
5.PIC18F2220-ISO.pdf
(6 pages)
6.PIC18F2220-ISO.pdf
(8 pages)
7.PIC18F2220-ISO.pdf
(6 pages)
8.PIC18F2220-ISO.pdf
(6 pages)
9.PIC18F2220-ISP.pdf
(388 pages)
Specifications of PIC18F2320-I/SP
Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SPI/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
5
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F1320-ISS PDF datasheet #2
- PIC18F2220-ISO PDF datasheet #3
- PIC18F2220-ISO PDF datasheet #4
- PIC18F2220-ISO PDF datasheet #5
- PIC18F2220-ISO PDF datasheet #6
- PIC18F2220-ISO PDF datasheet #7
- PIC18F2220-ISO PDF datasheet #8
- PIC18F2220-ISP PDF datasheet #9
- Current page: 195 of 394
- Download datasheet (7Mb)
17.4.17.3
Bus collision occurs during a Stop condition if:
a)
b)
FIGURE 17-31:
FIGURE 17-32:
© 2007 Microchip Technology Inc.
After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
SSPIF
BCLIF
SDA
PEN
SDA
SCL
PEN
BCLIF
P
SSPIF
SCL
P
Bus Collision During a Stop
Condition
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA asserted low
T
Assert SDA
BRG
T
BRG
PIC18F2220/2320/4220/4320
T
BRG
T
BRG
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Register 17-31). If the SCL pin is sam-
pled low before SDA is allowed to float high, a bus col-
lision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 17-32).
SCL goes low before SDA goes high,
set BCLIF
T
BRG
T
BRG
SDA sampled
low after T
set BCLIF
DS39599G-page 193
‘0’
‘0’
‘0’
‘0’
BRG
,
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