PIC18F4610-I/P Microchip Technology, PIC18F4610-I/P Datasheet - Page 357

IC MCU FLASH 32KX16 40DIP

PIC18F4610-I/P

Manufacturer Part Number
PIC18F4610-I/P
Description
IC MCU FLASH 32KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4610-I/P

Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3968 B
Interface Type
CCP/ECCP/EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit
Data Rom Size
3968 B
Height
3.81 mm
Length
52.26 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.2 V
Width
13.84 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F4610-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
27.2
The following sections give the technical details of the
packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Package Details
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
D
p
A
E
L
B
n
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
Preliminary
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
PIC18F2X1X/4X1X
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
6.99
3.18
0.20
8.13
7.62
1.02
0.41
5
5
MILLIMETERS
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
DS39636A-page 355
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15

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