PIC18F8520-I/PT Microchip Technology, PIC18F8520-I/PT Datasheet - Page 13

• Manufacturer Part Number: PIC18F8520-I/PT
• Description: IC MCU FLASH 16KX16 EEPROM80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F8520-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 80-TFQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C/SPI/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 68
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183022, DM183032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

REVISION HISTORY
Rev A Document (5/2003)
First revision of this document. Silicon issues 1 (I/O
Ports), 2 (Core) and 3 (MSSP). Data Sheet Clarification
issues 1 (A/D), 2 (Data EEPROM), 3 (Memory),
4 (Timer0), 5 (Pin Diagrams), 6 (MSSP), 7 (A/D Con-
verter Characteristics), 8 (Electrical Characteristics),
9 (Low-Power Timer1), 10 (Table 23-1: Configuration
Bits and Device IDs), 11 (Register 23-5: CONFIG3H:
Configuration Register 3 High), 12 (DC Characteristics)
and
Requirements).
Rev B Document (3/2004)
Added silicon issues 4 (External Memory Bus) and 5
(USART). Previous Data Sheet Clarification issues 1-9
and 11 were removed; previous issues 10, 12 and 13
remain and are now numbered 1-3.
Rev C Document (8/2004)
Revised silicon issue 3 (MSSP – SPI, Slave Mode).
Revised Data Sheet Clarification issue 2 (DC
Characteristics) and added issue 4 (Timer0 Block
Diagrams), 5 (DC Characteristics – V
and 6 (DC Characteristics).
Rev D Document 1/2005)
Removed silicon issue 3 (MSSP – SPI, Slave Mode).
Updated silicon issues 1 (I/O Ports – Parallel Slave
Port), 2 (Core – DAW Instruction), 3 (External Memory
Bus)
Clarification issues 1 (Table 23-1: Configuration Bits
and Device IDs), 2 (DC Characteristics: Power-Down
and
Programming
Diagrams)
Specifications. Added Data Sheet Clarification issues
7 (Voltage-Frequency Graph), 8 (External Clock
Timing
Reference Specifications), 11 (OSCCON Register),
12 (Instruction Set – BTG) and 13 (A/D Converter
Characteristics).
 2005 Microchip Technology Inc.
Supply
13
and
Requirements),
(Table
and
4
Current),
Requirements),
(USART).
5
26-4:
(DC
3
9
Characteristics
Memory
Revised
(Table
(CCP),
4
DD
(Timer0
26-4:
Specifications)
10
Programming
Data
(Voltage
Memory
–
Sheet
Block
V
DD
PIC18F6520/8520
DS80157D-page 13