AT32UC3B1256-Z1UT Atmel, AT32UC3B1256-Z1UT Datasheet - Page 60
AT32UC3B1256-Z1UT
Manufacturer Part Number
AT32UC3B1256-Z1UT
Description
IC MCU AVR32 256KB FLASH 48-QFN
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheet
1.AT32UC3B164-Z1UT.pdf
(105 pages)
Specifications of AT32UC3B1256-Z1UT
Core Processor
AVR
Core Size
32-Bit
Speed
60MHz
Connectivity
I²C, IrDA, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
28
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN Exposed Pad
For Use With
ATSTK600-TQFP48 - STK600 SOCKET/ADAPTER 48-TQFPATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMR770-1008 - ISP 4PORT ATMEL AVR32 MCU SPIATEVK1101 - KIT DEV/EVAL FOR AVR32 AT32UC3B
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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10.3
32059K–03/2011
Soldering Profile
Table 10-14
Table 10-14. Soldering Profile
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5⋅C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25⋅C to Peak Temperature
It is recommended to apply a soldering temperature higher than 250°C.
gives the recommended soldering profile from J-STD-20.
Green Package
3°C/s
Min. 150°C, Max. 200°C
60-150s
30s
260°C
6°C/s
Max. 8mn
AT32UC3B
60
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