DSPIC30F6015-30I/PT Microchip Technology, DSPIC30F6015-30I/PT Datasheet - Page 220
DSPIC30F6015-30I/PT
Manufacturer Part Number
DSPIC30F6015-30I/PT
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F6015-30IPT.pdf
(232 pages)
3.DSPIC30F6015-30IPT.pdf
(14 pages)
4.DSPIC30F6015-30IPT.pdf
(12 pages)
5.DSPIC30F6015-30IPT.pdf
(18 pages)
Specifications of DSPIC30F6015-30I/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164315 - MODULE SKT MPLAB PM3 44TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F601530IPT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6015-30I/PT
Manufacturer:
SICK
Quantity:
1 000
Company:
Part Number:
DSPIC30F6015-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6015-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F6015-30IPT PDF datasheet #2
- DSPIC30F6015-30IPT PDF datasheet #3
- DSPIC30F6015-30IPT PDF datasheet #4
- DSPIC30F6015-30IPT PDF datasheet #5
- Current page: 220 of 232
- Download datasheet (4Mb)
dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70150D-page 220
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
b
e
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
N
β
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
φ
L
Units
NOTE 2
A2
A1
E1
D1
L1
N
A
E
D
α
E1
e
L
φ
c
b
β
A
A1
E
0.95
0.05
0.45
0.09
0.22
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.65 BSC
1.00 REF
NOM
1.00
0.60
0.32
3.5°
12°
12°
80
–
–
–
Microchip Technology Drawing C04-116B
© 2008 Microchip Technology Inc.
MAX
1.20
0.15
0.75
0.38
1.05
0.20
13°
13°
7°
α
A2
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