DSPIC30F6014A-30I/PF Microchip Technology, DSPIC30F6014A-30I/PF Datasheet - Page 174

• Manufacturer Part Number: DSPIC30F6014A-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014A-30I/PF

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 80-TQFP, 80-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 68
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC30F6011A/6012A/6013A/6014A
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70143E-page 174
dsPIC30F601xA-30I
dsPIC30F601xA-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
INT
Junction to ambient thermal resistance, Theta-ja (
P
I
Range
/
O
=
=
V
∑
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
D D
(
{
V
×
DD
(
I
–
DD
Characteristic
V
O H
–
∑
Rating
} I
I
×
O H
)
OH
-40°C to 125°C
-40°C to 125°C
)
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Temp Range
+
∑
(
V
OL
×
I
OL
)
θ
JA
dsPIC30F601XA-30I
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
P
T
T
T
T
30
15
10
—
—
A
A
JA
JA
JA
JA
D
J
J
Min
Typ
-40
-40
-40
-40
34
34
39
39
Max MIPS
(T
© 2011 Microchip Technology Inc.
P
J
INT
- T
Max
Typ
—
—
—
—
—
—
—
—
dsPIC30F601XA-20E
+ P
A
)/
θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
20
10
—
—
—
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1