DSPIC30F6014A-30I/PF Microchip Technology, DSPIC30F6014A-30I/PF Datasheet - Page 220

• Manufacturer Part Number: DSPIC30F6014A-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014A-30I/PF

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 80-TQFP, 80-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 68
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC30F6011A/6012A/6013A/6014A
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70143C-page 218
Note:
REF: Reference Dimension, usually without tolerance, for information purposes only.
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MS-026
Drawing No. C04-092
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
B
See ASME Y14.5M
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
L
F
E
D
B
A
c
n
MIN
.037
.002
.018
.004
.007
.025
.039
Preliminary
2
1
D1
0°
5°
5°
CH x 45°
.039 REF.
L
.020 BSC
.551 BSC
.551 BSC
.472 BSC
.472 BSC
INCHES
D
NOM
.004
.024
.043
.039
.006
.009
.035
A1
3.5°
10°
10°
80
20
A
MAX
.047
.006
.030
.008
.045
.041
.011
15°
15°
F
7°
MIN
1.00
0.95
0.05
0.45
0.17
0.64
0.09
0°
5°
5°
MILLIMETERS*
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
1.00 REF.
0.50 BSC
© 2006 Microchip Technology Inc.
NOM
1.10
1.00
0.10
0.15
0.22
0.60
0.89
3.5°
Revised 07-22-05
10°
10°
80
20
A2
MAX
1.14
1.20
1.05
0.15
0.75
0.20
0.27
15°
15°
7°