DSPIC30F6014A-30I/PF Microchip Technology, DSPIC30F6014A-30I/PF Datasheet - Page 9

• Manufacturer Part Number: DSPIC30F6014A-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014A-30I/PF

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 80-TQFP, 80-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 68
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer2/3 Module ........................................................................................................................................................................ 73
11.0 Timer4/5 Module ....................................................................................................................................................................... 79
12.0 Input Capture Module................................................................................................................................................................. 83
13.0 Output Compare Module ............................................................................................................................................................ 87
14.0 SPI Module................................................................................................................................................................................. 91
15.0 I2C Module ................................................................................................................................................................................. 95
16.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 103
17.0 CAN Module ............................................................................................................................................................................. 111
18.0 Data Converter Interface (DCI) Module.................................................................................................................................... 123
19.0 12-bit Analog-to-Digital Converter (ADC) Module .................................................................................................................... 133
20.0 System Integration ................................................................................................................................................................... 143
21.0 Instruction Set Summary .......................................................................................................................................................... 163
22.0 Development Support............................................................................................................................................................... 171
23.0 Electrical Characteristics .......................................................................................................................................................... 175
24.0 Packaging Information.............................................................................................................................................................. 215
Appendix A: Revision History............................................................................................................................................................. 221
Appendix B: Device Comparisons ..................................................................................................................................................... 223
Appendix C: Migration from dsPIC30F601x to dsPIC30F601xA Devices.......................................................................................... 225
Index .................................................................................................................................................................................................. 227
The Microchip Web Site ..................................................................................................................................................................... 233
Customer Change Notification Service .............................................................................................................................................. 233
Customer Support .............................................................................................................................................................................. 233
Reader Response .............................................................................................................................................................................. 234
Product Identification System ............................................................................................................................................................ 235
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Device Overview .......................................................................................................................................................................... 9
CPU Architecture Overview........................................................................................................................................................ 15
Memory Organization ................................................................................................................................................................. 25
Address Generator Units............................................................................................................................................................ 39
Interrupts .................................................................................................................................................................................... 45
Flash Program Memory.............................................................................................................................................................. 51
Data EEPROM Memory ............................................................................................................................................................. 57
I/O Ports ..................................................................................................................................................................................... 63
Timer1 Module ........................................................................................................................................................................... 69
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dsPIC30F6011A/6012A/6013A/6014A
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Preliminary
DS70143C-page 7