DSPIC30F6010A-30I/PF Microchip Technology, DSPIC30F6010A-30I/PF Datasheet - Page 220
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DSPIC30F6010A-30I/PF
Manufacturer Part Number
DSPIC30F6010A-30I/PF
Description
IC DSPIC MCU/DSP 144K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20IP.pdf
(26 pages)
2.DSPIC30F6011A-30IPT.pdf
(6 pages)
3.DSPIC30F6015-30IPT.pdf
(232 pages)
4.DSPIC30F6015-30IPT.pdf
(14 pages)
5.DSPIC30F6015-30IPT.pdf
(12 pages)
6.DSPIC30F6015-30IPT.pdf
(18 pages)
7.DSPIC30F6010A-30IPF.pdf
(22 pages)
Specifications of DSPIC30F6010A-30I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
144KB
Supply Voltage Range
4.5V To 5.5V
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
68
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6010A-30I/PF
Manufacturer:
AD
Quantity:
2 100
Company:
Part Number:
DSPIC30F6010A-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70150D-page 220
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
b
e
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
N
β
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
φ
L
Units
NOTE 2
A2
A1
E1
D1
L1
N
A
E
D
α
E1
e
L
φ
c
b
β
A
A1
E
0.95
0.05
0.45
0.09
0.22
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.65 BSC
1.00 REF
NOM
1.00
0.60
0.32
3.5°
12°
12°
80
–
–
–
Microchip Technology Drawing C04-116B
© 2008 Microchip Technology Inc.
MAX
1.20
0.15
0.75
0.38
1.05
0.20
13°
13°
7°
α
A2