LPC2361FBD100,551 NXP Semiconductors, LPC2361FBD100,551 Datasheet - Page 39

• Manufacturer Part Number: LPC2361FBD100,551
• Description: IC ARM7 MCU FLASH 64K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2361FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 34 KB
• Interface Type: CAN/I2S/SPI/SSP/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 100LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4525; 935286991551

NXP Semiconductors
LPC2361_62_4
Product data sheet
9.2 Deep power-down mode
Fig 6.
Fig 7.
I
DD(DCDC)pd(3v3)
I
DD(IO)
(μA)
800
600
400
200
300
200
100
(μA)
V
Total DC-to-DC converter supply current I
in Power-down mode
I/O maximum supply current I
mode
V
0
0
−40
DD(3V3)
−40
DD(3V3)
= V
= V
i(VBAT)
DD(DCDC)(3V3)
V
V
Rev. 04 — 4 March 2010
−15
−15
DD(DCDC)(3V3)
DD(DCDC)(3V3)
= 3.3 V; T
V
V
DD(3V3)
DD(3V3)
= 3.3 V; T
amb
= 3.3 V
= 3.0 V
= 3.3 V
= 3.0 V
= 25 °C.
10
10
amb
DD(IO)
= 25 °C.
versus temperature in Deep power-down
DD(DCDC)pd(3V3)
35
35
Single-chip 16-bit/32-bit MCU
at different temperatures
60
60
LPC2361/62
temperature (°C)
temperature (°C)
002aae051
002aae046
© NXP B.V. 2010. All rights reserved.
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