LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 44
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LPC2387FBD100,551
Manufacturer Part Number
LPC2387FBD100,551
Description
IC ARM7 MCU FLASH 512K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Specifications of LPC2387FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
Development Tools By Supplier
OM11013
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Cpu Family
LPC2000
Device Core
ARM7TDMI-S
Device Core Size
16/32Bit
Frequency (max)
72MHz
Total Internal Ram Size
98KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
568-4322
935284932551
LPC2387FBD100-S
935284932551
LPC2387FBD100-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2387FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
11. Dynamic characteristics
Table 7.
T
[1]
[2]
[3]
LPC2387
Product data sheet
Symbol
External clock (see
f
T
t
t
t
t
I
t
SSP interface
t
osc
CHCX
CLCX
CLCH
CHCL
2
f(o)
su(SPI_MISO)
amb
Fig 12. External clock timing (with an amplitude of at least V
cy(clk)
C-bus pins (P0[27] and P0[28])
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
Bus capacitance C
=
−
40
°
Dynamic characteristics
C to +85
Parameter
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
output fall time
SPI_MISO set-up time
b
Figure
°
C for commercial applications; V
in pF, from 10 pF to 400 pF.
12)
All information provided in this document is subject to legal disclaimers.
Conditions
V
T
in SPI Master mode; see
Figure 14
amb
IH
t
CHCL
to V
Rev. 4 — 10 February 2011
= 25 °C; measured
IL
DD(3V3)
t
CLCX
over specified ranges.
i(RMS)
T
cy(clk)
= 200 mV)
t
CLCH
t
CHCX
Min
1
42
T
T
-
-
20 + 0.1 × C
-
cy(clk)
cy(clk)
× 0.4
× 0.4
[1]
b
Single-chip 16-bit/32-bit MCU
[3]
002aaa907
Typ
-
-
-
-
-
-
-
11
[2]
LPC2387
© NXP B.V. 2011. All rights reserved.
Max
25
1000
-
-
5
5
-
-
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
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