STM8L101K3T6 STMicroelectronics, STM8L101K3T6 Datasheet - Page 67

MCU 8KB FLASH MEM LP 32-LQFP

STM8L101K3T6

Manufacturer Part Number
STM8L101K3T6
Description
MCU 8KB FLASH MEM LP 32-LQFP
Manufacturer
STMicroelectronics
Series
STM8L EnergyLiter
Datasheet

Specifications of STM8L101K3T6

Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Infrared, POR, PWM, WDT
Number Of I /o
30
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
STM8L10x
Core
STM8
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
30
Number Of Timers
3
Operating Supply Voltage
1.65 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWSTM8
Minimum Operating Temperature
- 40 C
For Use With
497-10038 - EVAL KIT LCD COUNTER STM8L101497-10039 - EVAL DEV KIT FOR STM8L101
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10036
STM8L101K3T6

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0
1. Drawing is not to scale.
2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-
4. Dimensions are in millimeters.
STM8L101xx
10.2
Table 39.
Figure 37. UFQFPN32 - 32-lead ultra thin fine pitch
side pad to PCB ground.
Dim.
D2
A1
A3
E2
A
D
E
b
e
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
Package mechanical data
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
package mechanical data
quad flat no-lead package outline
(5 x 5)
b
8
1
32
9
0.00
0.18
4.90
4.90
3.40
Min
0.5
(1)(2)(3)
e
Bottom view
D2
D
16
0.152
0.500
L
0.55
0.02
0.23
5.00
3.50
5.00
3.50
mm
Typ
17
24
L
A1
E
A
Doc ID 15275 Rev 11
ddd C
A0B8_ME
Max
0.05
0.28
5.10
5.10
3.60
0.6
Figure 38. UFQFPN32 recommended
0.0197
0.0071
0.1929
0.1929
0.1339
Min
0
footprint
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
Package characteristics
0.006
Typ
(1)(4)
(1)
0.0110
0.0236
0.0020
0.2008
0.2008
0.1417
Max
67/81

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