STM32F100RBH6B STMicroelectronics, STM32F100RBH6B Datasheet - Page 9
![MCU 32BIT ARM 128K FLASH 64LQFP](/photos/28/60/286080/stm32f100rbh6b_sml.jpg)
STM32F100RBH6B
Manufacturer Part Number
STM32F100RBH6B
Description
MCU 32BIT ARM 128K FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F100R4T6B.pdf
(87 pages)
Specifications of STM32F100RBH6B
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM32100B-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10495
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100RBH6B
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STM32F100RBH6BTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
1
Introduction
This datasheet provides the ordering information and mechanical device characteristics of
the STM32F100x4, STM32F100x6, STM32F100x8 and STM32F100xB value line
microcontrollers. In the rest of the document, the STM32F100x4 and STM32F100x6 are
referred to as low-density devices while the STM32F100x8 and STM32F100xB are
identified as medium-density devices.
The STM32F100xx datasheet should be read in conjunction with the low- and medium-
density STM32F100xx reference manual.
For information on programming, erasing and protection of the internal Flash memory
please refer to the STM32F100xx Flash programming manual.
The reference and Flash programming manuals are both available from the
STMicroelectronics website www.st.com.
For information on the Cortex™-M3 core please refer to the Cortex™-M3 Technical
Reference Manual, available from the www.arm.com website at the following address:
http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0337e/.
Doc ID 16455 Rev 6
Introduction
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