STM32F105RBT6 STMicroelectronics, STM32F105RBT6 Datasheet - Page 61

MCU ARM 128KB FLASH MEM 64-LQFP

STM32F105RBT6

Manufacturer Part Number
STM32F105RBT6
Description
MCU ARM 128KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F105RBT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F105x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8920

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STM32F105xx, STM32F107xx
5.3.15
Communications interfaces
I
Unless otherwise specified, the parameters given in
performed under the ambient temperature, f
conditions summarized in
The STM32F105xx and STM32F107xx I
standard I
SCL are mapped to are not “true” open-drain. When configured as open-drain, the PMOS
connected between the I/O pin and V
The I
characteristics
and SCL) .
Table 40.
1. Guaranteed by design, not tested in production.
2. f
3. The maximum hold time of the Start condition has only to be met if the interface does not stretch the low
4. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the
2
t
C interface characteristics
w(STO:STA)
Symbol
t
t
t
t
t
w(SCLH)
w(SCLL)
t
su(SDA)
t
t
su(STO)
to achieve the fast mode I
mode maximum clock 400 kHz.
period of SCL signal.
undefined region of the falling edge of SCL.
t
t
t
su(STA)
h(SDA)
PCLK1
r(SDA)
h(STA)
r(SCL)
f(SDA)
f(SCL)
C
2
C characteristics are described in
b
must be higher than 2 MHz to achieve standard mode I
2
C communication protocol with the following restrictions: the I/O pins SDA and
SCL clock low time
SCL clock high time
SDA setup time
SDA data hold time
SDA and SCL rise time
SDA and SCL fall time
Start condition hold time
Repeated Start condition
setup time
Stop condition setup time
Stop to Start condition time
(bus free)
Capacitive load for each bus
line
I
2
C characteristics
for more details on the input/output alternate function characteristics (SDA
Parameter
2
C frequencies and it must be a mulitple of 10 MHz in order to reach I
Table
Doc ID 15274 Rev 5
9.
DD
Standard mode I
2
Table
is disabled, but is still present.
C interface meets the requirements of the
Min
250
0
4.7
4.0
4.0
4.7
4.0
4.7
PCLK1
(3)
40. Refer also to
frequency and V
2
Table 40
C frequencies. It must be higher than 4 MHz
1000
Max
300
400
2
C
(1)
are derived from tests
20 + 0.1C
Fast mode I
Section 5.3.12: I/O port
Electrical characteristics
Min
100
0
1.3
0.6
0.6
0.6
0.6
1.3
(4)
DD
supply voltage
b
2
C
900
Max
300
300
400
(1)(2)
(3)
2
C fast
61/101
Unit
s
s
pF
µs
ns
µs

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