STM32F105RBT6 STMicroelectronics, STM32F105RBT6 Datasheet - Page 98
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STM32F105RBT6
Manufacturer Part Number
STM32F105RBT6
Description
MCU ARM 128KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F105V8T6.pdf
(101 pages)
Specifications of STM32F105RBT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F105x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8920
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F105RBT6
Manufacturer:
STMicroelectronics
Quantity:
20 000
Company:
Part Number:
STM32F105RBT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F105RBT6
Manufacturer:
ST
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20 000
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Part Number:
STM32F105RBT6TR
Manufacturer:
STMicroelectronics
Quantity:
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Part Number:
STM32F105RBT6TR
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Quantity:
20 000
Revision history
98/101
Table 64.
19-Jun-2009
Date
Document revision history (continued)
Revision
3
Section 2.3.8: Boot modes
interface with dedicated DMA and IEEE 1588 support
Section 2.3.24: Remap capability
Figure 1: STM32F105xx and STM32F107xx connectivity line block
diagram
In
– I2S3_WS, I2S3_CK and I2S3_SD default alternate functions
– small changes in signal names
–
– ETH_MII_PPS_OUT and ETH_RMII_PPS_OUT replaced by
– ETH_MII_MDIO and ETH_RMII_MDIO replaced by ETH_MDIO
– ETH_MII_MDC and ETH_RMII_MDC replaced by ETH_MDC
Figures:
(at 3.6 V) - code with data processing running from RAM, peripherals
enabled
frequency (at 3.6 V) - code with data processing running from RAM,
peripherals disabled
Table 13: Maximum current consumption in Run mode, code with
data processing running from
consumption in Run mode, code with data processing running from
RAM
code running from Flash or RAM
Figure 12
I
maximum current consumptions in Stop and Standby
Figure 11: Typical current consumption in Stop mode with regulator
in Run mode versus temperature at different VDD
Typical current consumption in Standby mode versus temperature at
different VDD values
Standby mode versus temperature at different VDD values
Table 17: Typical current consumption in Run mode, code with data
processing running from
consumption in Sleep mode, code running from Flash or RAM
Table 19: Peripheral current consumption
f
characteristics.
Min PLL input clock (f
modified in
ACC
characteristics.
characteristics
Modified:
Figure 29: I2S master timing diagram (Philips protocol)(1)
Figure 31: Ethernet SMI timing
BGA100 package removed.
Section 6.2: Thermal characteristics
DD
HSE_ext
Doc ID 15274 Rev 5
added
Note 6
ETH_PPS_OUT
Table 5: Pin
supply current in Stop mode modified in
HSI
and
max values modified in
modified in
and
and
Typical current consumption in Run mode versus frequency
modified
Figure 28: I2S slave timing diagram (Philips
Table 15: Maximum current consumption in Sleep mode,
and
Table 27: PLL
Typical current consumption in Run mode versus
Figure 5: Memory map
Figure 13
definitions:
updated.
Table 31: EMS characteristics
Table 20: High-speed external user clock
removed.
and
PLL_IN
Table 42: SPI characteristics
show typical curves. PLL1 renamed to PLL.
Figure 13: Typical current consumption in
Flash,
characteristics.
and
), f
Changes
PLL_OUT
Flash,
diagram.
Section 2.3.20: Ethernet MAC
Table 24: HSI oscillator
Table 18: Typical current
are to be determined.
added.
STM32F105xx, STM32F107xx
updated.
added. Small text changes.
Table 14: Maximum current
min and f
updated.
Table 16: Typical and
and
PLL_VCO
values,
Table 32: EMI
modes.
updated.
protocol)(1),
updated.
min
Figure 13:
and
updated.
and