STM32F103VBH6 STMicroelectronics, STM32F103VBH6 Datasheet - Page 49

MCU ARM 128KB FLASH MEM 100-LFBG

STM32F103VBH6

Manufacturer Part Number
STM32F103VBH6
Description
MCU ARM 128KB FLASH MEM 100-LFBG
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F103VBH6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFBGA
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
CAN, I2C, SPI, USART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
100
Number Of Timers
3 x 16 bit
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ST-LINK
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-6069

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STM32F103xx
5.3.15
Communications interfaces
I
Unless otherwise specified, the parameters given in
performed under ambient temperature, f
summarized in
The STM32F103xx performance line I
I
mapped to are not “true” open-drain. When configured as open-drain, the PMOS connected
between the I/O pin and V
diode between the I/O pin and V
connected to the I
master node remains powered on. Otherwise, the STM32F103xx would be powered by the
protection diode.
The I
characteristics
and SCL) .
Table 34.
1. Values based on standard I
2. f
3. The maximum hold time of the Start condition has only to be met if the interface does not stretch the low
4. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the
2
2
t
C communication protocol with the following restrictions: the I/O pins SDA and SCL are
C interface characteristics
w(STO:STA)
Symbol
t
t
t
t
t
w(SCLH)
w(SCLL)
t
su(SDA)
t
t
t
t
su(STO)
higher than 4 MHz to achieve the maximum fast mode I
period of SCL signal.
undefined region of the falling edge of SCL.
t
su(STA)
h(SDA)
r(SDA)
h(STA)
PCLK1
r(SCL)
f(SDA)
f(SCL)
C
2
C characteristics are described in
b
must be higher than 2 MHz to achieve the maximum standard mode I
SCL clock low time
SCL clock high time
SDA setup time
SDA data hold time
SDA and SCL rise time
SDA and SCL fall time
Start condition hold time
Repeated Start condition
setup time
Stop condition setup time
Stop to Start condition time
(bus free)
Capacitive load for each bus
line
I
2
C characteristics
for more details on the input/output alternate function characteristics (SDA
Table
2
C bus, it is not possible to power off the STM32F103xx while another I
Parameter
7.
2
DD
C protocol requirement, not tested in production.
is disabled, but is still present. In addition, there is a protection
DD
. As a consequence, when multiple master devices are
2
C interface meets the requirements of the standard
Standard mode I
PCLK1
Table
Min
250
0
4.7
4.0
4.0
4.7
4.0
4.7
(3)
frequency and V
34. Refer also to
2
C frequency.
Table 34
1000
Max
300
400
2
C
(1)
are derived from tests
20 + 0.1C
20 + 0.1C
DD
Section 5.3.12: I/O port pin
Fast mode I
2
Electrical characteristics
Min
100
C frequency. It must be
0
1.3
0.6
0.6
0.6
0.6
1.3
supply voltage conditions
(4)
b
b
2
C
900
Max
300
300
400
(1)(2)
(3)
Unit
pF
49/67
µs
ns
µs
µs
µs
2
C

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