MC9S08QG4CDTE Freescale Semiconductor, MC9S08QG4CDTE Datasheet - Page 291

• Manufacturer Part Number: MC9S08QG4CDTE
• Description: IC MCU 4K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG4CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 256Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering information for MC9S08QG8 and MC9S08QG4 devices.
B.1.1
B.2
The following pages are mechanical specifications for MC9S08QG8/4 package options. See
the document number for each package type.
Freescale Semiconductor
1
2
See
See
Device Number
(MC = Fully Qualified)
MC9S08QG8
MC9S08QG4
1
Table 1-1
Table B-2
(9 = FLASH-based)
Ordering Information
Mechanical Drawings
Only maskset 4M77B has this additional number.
Device Numbering Scheme
for a complete description of modules included on each device.
for package information.
Memory
1
Status
Family
Core
Pin Count
FLASH
24
16
16
16
8K
4K
MC
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
9 S08 QG
Table B-1. Device Numbering System
Memory
Table B-2. Package Information
TSSOP
PDIP
Type
QFN
QFN
8
RAM
512
256
(4)
X
XX
Designator
E
PB
DT
FK
FF
Memory Size (in Kbytes)
24 QFN
24 QFN
4M77B
Package designator (see
Temperature range
24-Pin
RoHS compliance indicator (E = yes)
1
.
Document No.
98ASB42431B
98ARE10614D
98ASH70247A
98ARL10605D
Available Packages
16 TSSOP
16 TSSOP
16 PDIP
16 QFN
16 QFN
16-Pin
(C = –40°C to +85°C)
(M = –40°C to +125°C)
Table
B-2)
2
8 NB SOIC
8 NB SOIC
8 PDIP
Table B-2
8 DFN
8 DFN
8-Pin
for
289