C8051F996-GM Silicon Laboratories Inc, C8051F996-GM Datasheet - Page 40
![IC MCU 8BIT 8KB FLASH 24QFN](/photos/12/15/121587/c8051f9xx_24-qfn_sml.jpg)
C8051F996-GM
Manufacturer Part Number
C8051F996-GM
Description
IC MCU 8BIT 8KB FLASH 24QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F9xxr
Specifications of C8051F996-GM
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
24-UQFN Exposed Pad, 24-HUQFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Cap Sense, POR, PWM, Temp Sensor, WDT
Number Of I /o
17
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F9x
Core
8051
Data Ram Size
512 B
Interface Type
I2C, SMBus, Enhanced UART, Enhanced SPI
Maximum Clock Frequency
7 KHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.4 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F996DK
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
On-chip Dac
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1943-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F996-GM
Manufacturer:
SILICON
Quantity:
570
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- Download datasheet (3Mb)
C8051F99x-C8051F98x
40
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
be used to assure good solder paste release.
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component stand-off.
for Small Body Components.
Dimension
GD
GE
D2
ZE
ZD
E2
W
D
E
X
Y
e
f
Table 3.3. PCB Land Pattern
Rev. 1.0
1.60
1.60
2.10
2.10
Min
—
—
—
—
0.50 BSC
2.71 REF
2.71 REF
2.53 REF
0.61 REF
Max
1.80
1.80
0.34
0.28
3.31
3.31
—
—
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