C8051F007-GQ Silicon Laboratories Inc, C8051F007-GQ Datasheet - Page 21

IC 8051 MCU 32K FLASH 32LQFP

C8051F007-GQ

Manufacturer Part Number
C8051F007-GQ
Description
IC 8051 MCU 32K FLASH 32LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F00xr
Datasheets

Specifications of C8051F007-GQ

Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
8
Ram Size
2.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 4x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F0x
Core
8051
Data Bus Width
8 bit
Data Ram Size
2.25 KB
Interface Type
I2C, SMBus, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
8
Number Of Timers
4 bit
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F005DK
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 4 Channel
On-chip Dac
12 bit, 2 Channel
Package
32LQFP
Device Core
8051
Family Name
C8051F0xx
Maximum Speed
25 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1188 - DEV KIT FOR F005/006/007
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1190

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4. PINOUT AND PACKAGE DEFINITIONS
21
VDD
DGND
AV+
AGND
TCK
TMS
TDI
TDO
XTAL1
XTAL2
/RST
VREF
CP0+
CP0-
CP1+
CP1-
DAC0
DAC1
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
C8051F000/1/2/5/6/7
C8051F010/1/2/5/6/7
Name
F000
F005
F010
F015
31,
40,
30,
41,
16,
62
61
17
15
22
21
28
29
18
19
20
64
63
10
11
12
5,
6
4
3
2
1
7
8
9
Pin Numbers
F001
F006
F011
F016
23,
22,
33,
27,
13,
44,
32
19
43
12
18
17
20
21
14
15
16
45
46
48
47
3
2
1
4
5
6
7
8
9
F002
F007
F012
F017
18,
17,
20
21
29
30
14
13
15
16
10
11
12
32
31
9,
8,
3
2
1
4
5
6
7
D In
D In
D In
D Out
A In
A Out
D I/O
A I/O
A In
A In
A In
A In
A Out
A Out
A In
A In
A In
A In
A In
A In
Type
Table 4.1. Pin Definitions
Description
Digital Voltage Supply.
Digital Ground.
Positive Analog Voltage Supply.
Analog Ground.
JTAG Test Clock with internal pull-up.
JTAG Test-Mode Select with internal pull-up.
JTAG Test Data Input with internal pull-up. TDI is latched on a rising edge of
TCK.
JTAG Test Data Output with internal pull-up. Data is shifted out on TDO on
the falling edge of TCK. TDO output is a tri-state driver.
Crystal Input. This pin is the return for the internal oscillator circuit for a
crystal or ceramic resonator. For a precision internal clock, connect a crystal
or ceramic resonator from XTAL1 to XTAL2. If overdriven by an external
CMOS clock, this becomes the system clock.
Crystal Output. This pin is the excitation driver for a crystal or ceramic
resonator.
Chip Reset. Open-drain output of internal Voltage Supply monitor. Is driven
low when VDD is < 2.7V. An external source can force a system reset by
driving this pin low.
Voltage Reference. When configured as an input, this pin is the voltage
reference for the MCU. Otherwise, the internal reference drives this pin.
Comparator 0 Non-Inverting Input.
Comparator 0 Inverting Input.
Comparator 1 Non-Inverting Input.
Comparator 1 Inverting Input.
Digital to Analog Converter Output 0. The DAC0 voltage output. (See
Section 7 DAC Specification for complete description).
Digital to Analog Converter Output 1. The DAC1 voltage output. (See
Section 7 DAC Specification for complete description).
Analog Mux Channel Input 0. (See ADC Specification for complete
description).
Analog Mux Channel Input 1. (See ADC Specification for complete
description).
Analog Mux Channel Input 2. (See ADC Specification for complete
description).
Analog Mux Channel Input 3. (See ADC Specification for complete
description).
Analog Mux Channel Input 4. (See ADC Specification for complete
description).
Analog Mux Channel Input 5. (See ADC Specification for complete
description).
Rev. 1.7

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