C8051F060-GQ Silicon Laboratories Inc, C8051F060-GQ Datasheet - Page 190

• Manufacturer Part Number: C8051F060-GQ
• Description: IC 8051 MCU 64K FLASH 100TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F06xr

Specifications of C8051F060-GQ

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 59
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 2x16b, 8x10b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4.25 KB
• Interface Type: CAN/I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 5
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F060DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 2-ch x 12-bit
• No. Of I/o's: 59
• Ram Memory Size: 4352Byte
• Cpu Speed: 25MHz
• No. Of Timers: 5
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1214 - DEV KIT FOR F060/F062/F063
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1213

C8051F060/1/2/3/4/5/6/7
17.4. Multiplexed and Non-multiplexed Selection
The External Memory Interface is capable of acting in a Multiplexed mode or a Non-multiplexed mode,
depending on the state of the EMD2 (EMI0CF.4) bit.
17.4.1. Multiplexed Configuration
In Multiplexed mode, the Data Bus and the lower 8-bits of the Address Bus share the same Port pins:
AD[7:0]. In this mode, an external latch (74HC373 or equivalent logic gate) is used to hold the lower 8-bits
of the RAM address. The external latch is controlled by the ALE (Address Latch Enable) signal, which is
driven by the External Memory Interface logic. An example of a Multiplexed Configuration is shown in
Figure 17.3.
In Multiplexed mode, the external MOVX operation can be broken into two phases delineated by the state
of the ALE signal. During the first phase, ALE is high and the lower 8-bits of the Address Bus are pre-
sented to AD[7:0]. During this phase, the address latch is configured such that the ‘Q’ outputs reflect the
states of the ‘D’ inputs. When ALE falls, signaling the beginning of the second phase, the address latch
outputs remain fixed and are no longer dependent on the latch inputs. Later in the second phase, the Data
Bus controls the state of the AD[7:0] port at the time /RD or /WR is asserted.
See
190
E
M
I
F
Section “17.6.2. Multiplexed Mode” on page 199
/WR (P4.7)
ALE (P4.5)
/RD (P4.6)
AD[7:0]
A[15:8]
(P6)
(P7)
Figure 17.3. Multiplexed Configuration Example
ADDRESS/DATA BUS
ADDRESS BUS
Rev. 1.2
for more information.
V
DD
(Optional)
8
74HC373
G
D
Q
A[15:8]
A[7:0]
I/O[7:0]
OE
WE
CE
64K X 8
SRAM