PIC12F615-I/MD Microchip Technology, PIC12F615-I/MD Datasheet - Page 143
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F615-I/MD
Manufacturer Part Number
PIC12F615-I/MD
Description
IC PIC MCU FLASH 1KX14 8DFN
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(26 pages)
3.PIC12F609T-ISN.pdf
(8 pages)
4.PIC12F615-ESN.pdf
(168 pages)
Specifications of PIC12F615-I/MD
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
5
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DFN
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
3
Digital Ic Case Style
DFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164326 - MODULA SKT PM3 20QFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC12F609T-ISN PDF datasheet
- PIC12F609T-ISN PDF datasheet #2
- PIC12F609T-ISN PDF datasheet #3
- PIC12F615-ESN PDF datasheet #4
- Current page: 143 of 212
- Download datasheet (2Mb)
16.0
Absolute Maximum Ratings
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by GPIO ...................................................................................................................... 90 mA
Maximum current sourced GPIO...................................................................................................................... 90 mA
Note 1:
2010 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
I
OL
DD
).
with respect to V
IK
(1)
OK
(V
DD
............................................................................................................................... 800 mW
I
SS
(Vo < 0 or Vo >V
< 0 or V
pin ......................................................................................................................... 95 mA
pin ...................................................................................................................... 95 mA
SS
PIC12F609/615/617/12HV609/615
I
> V
(†)
................................................................................................... -0.3V to +6.5V
DD
SS
)20 mA
DD
........................................................................... -0.3V to (V
)20 mA
DIS
= V
DD
x {I
DD
– I
OH
} + {(V
DD
– V
OH
) x I
DS41302D-page 143
OH
} + (V
DD
+ 0.3V)
O
l x
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